Reference Documents; Thermal Design Tool Availability - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual

Introduction—Core™ 2 Duo Mobile Processors
Table 1. Definition of Terms (Sheet 2 of 2)
Term
1.3

Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the
following documents:
• Intel® Core™2 Duo Processor for Intel® Centrino® Duo Mobile Technology Datasheet
Documents are located at developer.intel.com. Contact your Intel field sales representative for
additional information.
1.4

Thermal Design Tool Availability

Intel provides thermal simulation models of the device and a thermal model user's guide to aid
system designers in simulating, analyzing, and optimizing thermal solutions in an integrated, system-
level environment. The models are for use with commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tools including Flotherm* (version 7.1 or higher) by Flomerics, Inc. or
Icepak* by Fluent, Inc. Contact your Intel representative to order the thermal models and associated
user's guides.
June 2008
Order Number: 320028-001
Thermal Interface Material – the thermally conductive compound between the
TIM heatsink and die. This material fills air gaps and voids, and enhances spreading of
the heat from the die to the heatsink.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75
U
inches, 2U equals 3.50 inches, etc.
W Watt
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
Definition
TDG
8