Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual page 4

Figures-Core™ 2 Duo Mobile Processors
Figures
1 Thermal Design Process .............................................................................................. 7
2 Primary Side Keep Out Zone Requirements- Micro-FCPGA ............................................ 12
3 Primary Side Keep Out Zone Requirements- Micro-FCBGA ............................................ 13
4 Secondary Side Keep Out Zone Requirements .............................................................. 14
5 Processor Thermal Characterization Parameter Relationships ......................................... 16
6 AdvancedTCA* Reference Heatsink Assembly............................................................... 18
7 AdvancedTCA* Heatsink Thermal Performance vs. Volumetric Airflow Rate ...................... 19
8 1U Reference Heatsink Assembly ............................................................................... 20
9 1U Heatsink Thermal Performance vs. Volumetric Airflow Rate ....................................... 21
10 CompactPCI Reference Heatsink Assembly .................................................................. 21
11 cPCI Reference Heatsink Thermal Performance vs. Volumetric Flow Rate ......................... 22
12 Heatsink Orientation Relative to Airflow Direction ......................................................... 23
13 Measuring TLA with an Active Heatsink ....................................................................... 26
14 Measuring TLA with a Passive Heatsink ....................................................................... 27
15 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) ........ 31
16 AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) ........ 32
17 AdvancedTCA* Reference Heatsink Assembly............................................................... 33
18 AdvancedTCA* Reference Heatsink............................................................................. 34
19 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2) .......... 35
20 CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2) .......... 36
21 CompactPCI* Reference Heatsink Assembly................................................................. 37
22 CompactPCI* Reference Heatsink............................................................................... 38
23 1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2) ................................. 39
24 1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2) ................................. 40
25 1U Reference Heatsink Assembly ............................................................................... 41
26 1U Reference Heatsink.............................................................................................. 42
Tables
1 Definition of Terms..................................................................................................... 7
2 Thermal Specifications for the Intel
3 Required Heatsink Thermal Performance (Ψ
4 Reliability Requirements............................................................................................ 28
5 Reference Heatsink .................................................................................................. 29
6 Mechanical Drawings ................................................................................................ 30
June 2008
Order Number: 320028-001
®
Core™2 Duo processor.......................................... 10
) ............................................................. 17
JA
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
TDG
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