Cleanliness Requirements - Ruijie RG-AP810-I Hardware Installation And Reference Manual

Hardware Installation and Reference Guide
Note
The ambient temperature and humidity of the device are measured at the point that is 1.5 m (59.06 in.) above
the floor and 0.4 m (15.75 in.) before the device when there is no protective plate in front or at the back of the
device.
2.2.5

Cleanliness Requirements

Dust poses a major threat to the device. The indoor dust takes on a positive or negative static electric charge
when falling on the device, causing poor contact of the metallic joint. Such electrostatic adhesion may occur
more easily when the relative humidity is low, not only affecting the service life of the device, but also causing
communication faults. Table 2-1 describes the requirements for the dust content and granularity in the equipment
room.
Table 2-1 Requirements for Dust
Dust
Dust particles (diameter ≤ 0.5 μm)
Dust particles (0.5 μm ≤ diameter ≤ 1
μm)
Dust particles (1 μm ≤ diameter ≤ 3 μm)
Dust particles (3 μm ≤ diameter ≤ 1 μm)
Apart from dust, the salt, acid, and sulfide in the air in the equipment room must meet strict requirements. These
harmful substances will accelerate metal corrosion and component aging. Therefore, the equipment room should
be properly protected against the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, and chlorine gas. Table 2-2 lists limit values for harmful gases.
Table 2-2 Requirements for Gases
Gas
Sulfur dioxide (SO
Hydrogen sulfide (HS)
Nitrogen dioxide (NO
Ammonia gas (NH
Chlorine gas (CI
Average (mg/m
) 0.2
2
0.006
) 0.04
2
) 0.05
3
) 0.01
2
Unit
3
Particles/m
3
Particles/m
3
Particles/m
3
Particles/m
3
)
14
Preparing for Installation
Content
≤ 1.4 × 10^7
≤ 7 × 10^5
≤ 2.4 × 10^5
≤ 1.3 × 10^5
3
Maximum (mg/m )
1.5
0.03
0.15
0.15
0.3