Introduction - Pace PROGRAMMABLE THERMOFLO Operation & Maintenance Manual

GENERAL INFORMATION

INTRODUCTION

This manual will provide you with the information necessary to properly set up, operate and maintain the
ThermoFlo Unit. Please read this manual thoroughly before using the unit. The ThermoFlo unit is a complete
system designed for hot air removal and installation of SMD components, including Ball Grid Arrays (BGAs).
The following key features allow process controlled placement and reflow of BGAs and SMD components.
ThermoFlo Handpiece
The user-friendly ThermoFlo static-safe handpiece incorporates a powerful heater and has easy-access heat
cycle and vacuum pick switches on the handle. A built-in, self-adjusting vacuum pick has a push-pull action,
allowing components to be lifted automatically after solder reflow. When utilized with the ThermoFlo
System work platform, the handpiece is easily converted to a precision reflow head.
Microprocessor Control
Precision control of temperature (closed-loop control),cycle time (adjustable in one second increments) and
blower speed, provides consistent, repeatable results in successive reflow operations. Utilizing the Quiet Flo
(low noise) turbine blower, pressure/flow rate is easily controlled and maintained at optimum levels for the
particular task at hand. A multi-level password lock-out prevents unauthorized changes; an audible
countdown timer indicates end of cycle and a built-in PC expansion interface (RS-232) provides memory
capabilities and process control beyond the Program Mode.
Multi-Mode Operation
Manual Mode - For fast and simple hand-held installations and removals.
Timed Mode -For process control with user-specified cycle time and automatic vacuum pick-up operation.
Program Mode - For full process control. Eighty (80) user-defined profiles including parameters for
preheat, soak, reflow and ramp-down zones for individual component/boards may be stored in
microprocessor memory.
Nozzles
PACE's exclusive QuickFit nozzle attachment system allow quick easy change out of any nozzle. A wide
range of inexpensive, standard nozzles are available. Custom design nozzles are also available.
Process Control
The ThermoFlo Profile Control Chart (page 24) and Profile Log (page 25) have been created to aid in the
development of customized reflow processes for your particular SMD tasks. Up to 80 user-defined profiles
may be stored in microprocessor memory for use in the Program Mode.
Optional Accessories
Lighting, Vision Systems, Fume Extraction a thermocouple meter and a PACE Heat Wave preheating
system and a large board holder are available options to the system.
The PACE ThermoFlo unit meets all applicable EOS/ESD and other government and industry specification
requirements (including MIL-STD-2000 and ANSI-J-STD-001) for high performance and safety.
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