Suggested Starting Parameters - Pace PROGRAMMABLE THERMOFLO Operation & Maintenance Manual

This chart provides a base starting point for the development of exact parameters ("Established Profile Guidelines") for your
surface mount rework process. Initial tests using these references may not result in complete solder reflow. Adjust the
reference values as necessary to obtain desired results.
1.
Procedure:
2.
3.
4.
Component
Outline Type
PBGA
PLCC
(J Lead)
PQFP
SOIC
Chip
Component
Figure 15.
THERMOFLO REFLOW PROFILES

SUGGESTED STARTING PARAMETERS

Select the Component and Substrate which best matches your application.
Perform a test using the base parameters.
Adjust parameters as desired and perform aditional test runs.
When desired results are achieved, record process on a copy of Profile Control Chart or Profile Log.
NOTE: Blower Speed parameter is base reference for Reflow function.
Nozzle Process
Remove
Recommended
Type
Install
Remove
Appropriate Size
V-A-N Nozzle
Install
Remove
Appropriate Size
Box Nozzle
Install
Remove
Appropriate Size
Box Nozzle
Install
Remove
Appropriate Size
Pattern Nozzle
Install
Remove
Appropriate Size
Single Jet Nozzle
Install
©Copyright 1997, PACE Inc., Laurel Maryland All rights reserved. Printed in U.S.A.
PROCESS DEVELOPMENT
Parameter
(Temperature and
or
Blower Speed)
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature (°C)
Blower Speed
Temperature
Blower Speed
Temperature
Blower Speed
Temperature
Blower Speed
Substrate
(PCB Type)
Low Medium High
Mass Mass Mass
371 371 371
5 5 5
371 371 371
3 3 4
371 371 371
7 8 8
371 371 371
7 8 8
316 371 371
6 7 7
316 371 371
6 7 7
316 316 371
7 7 7
316 316 371
7 7 7
371 371 371
6 6 8
371 371 371
5 6 7
Reflow
Cycle
Time
(sec.)
77
90
30
30
18
18
15
15
11
12
23