Nozzle Selection - Pace PROGRAMMABLE THERMOFLO Operation & Maintenance Manual

OPERATION

NOZZLE SELECTION

Selection of the proper Nozzle is essential for achieving a quality component removal or installation. Each
ThermoFlo Nozzle is designed to properly direct the heated air.
The Replacement Parts section of this manual lists standard nozzles and the components for which they are
normally used. Custom nozzles are available upon request.
ThermoFlo Nozzles are available in 4 basic configurations.
V-A-N Nozzles - Are used for removal/replacement of BGA
components.
Box Nozzles - Used for removal/replacement of surface mount
components having solder connections on 4 sides of the component
(e.g., QFPs & PLCCs).
Pattern Nozzles - Used for removal/replacement of surface mount
components having solder connections on 2 sides of the component
(e.g., SOICs).
Single Jet Nozzles - Available in straight, curved and flat end versions,
these nozzles are used for removal/replacement of small surface mount
components (e.g.,chip components), small QFPs, Land Grid Arrays
(e.g., those used on pagers & cellular telephones) or for reflowing
solder on single solder connections.
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Figure 18.