Table of Contents
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CONTENTS (Cont)
Addressing and Selection
Address Inputs
Decoding and Selection
Timing and Control
Operating Modes
Internally Generated Timing
Regeneration Loop
Memory Retention
Power Distribution
DC Power
Section 3 - Input/Output Teletype Interface
Operation
Input Mode
Output Mode
Dummy Cycle
CHAPTER III
MAINTENANCE
Required Tools and Test Equipment
µ-PAC Locations
PAC Handling and Repair Procedures
Inserting and Removing System PACs
PAC Troubleshooting
Component Checking
Component Replacement
Maintenance Inspection
Computer System Preventive Maintenance
Computer System Troubleshooting
Corrective Maintenance Inspection
PAC Substitution
Single Pulse Operation
Memory Maintenance Procedures
Visual Inspection
Preventive Maintenance Procedures
Corrective Maintenance Procedures
Memory System Troubleshooting Procedures
Maintenance of Memory Magnetic Core Stack
CHAPTER IV
PARTS LIST
APPENDIX A
µ-PAC DESCRIPTIONS
iv
Page
2-36
2-36
2-36
2-42
2-42
2-42
2-43
2.-·U
2-45
2-45
2-46
2-48
2-48
2-50
2-52
3-1
3-1
3-2
3-2
3-2
3-2
3-2
3-3
3-3
3-3
3-3
3-3
3-4
3-4
3-4
3-4
3-5
3-5
3-7
4-1
A-1
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Table of Contents
