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PAC COMPLEMENT
Table 1-3 lists the type and quantity of the
µ-PAC
integrated circuit modules used in
the basic DDP-416 computer.
These
µ-PACs
are housed in the tilt-out assemblies provided
in the basic system equipment enclosure.
The
µ-PAC
layout for the computer central proc-
essing unit (CPU) and the memory are contained in Volume III of this manual.
The µ-PAC modules listed in Table 1-3 are described in the appendix of this volume.
Type
CC-002
CC-034
CC-035
CC-036
CC-038
CC-039
CC-043
CC-044
CC-045
CC-046
CC-054
CC-073
CC-079
CC-080
CC-085
CC-130
CC-153
CC-154
CM-003
CM-006
CM-022
CM-032
CM-033
CM-075
CM-106
DC-335
DI-335
DL-335
DN-335
OD-335
PA-335
PA-336
TG-335
Table 1-3.
Basic Computer,
µ-PAC
Complement
Driver Matrix
Carry Most Significant Bits
Carry Middle Bits
Carry Least Significant Bits
Column Memory Information Register and
Distribution Register
Column PAY
Power Failure Sense
Priority PAC
NAND Power Amplifier Type I
Master Clock
Pin Jumper PAC
NAND Power Amplifier Type II
Cable PAC
Cable PAC
Universal Flip-Flop
Resistor PAC
Line Driver PAC
Termination PAC
Timing Distribution
Selection PAC
Parallel Transfer Gate
Sense Amplifier
Sense Amplifier
Component PAC
Selection PAC
Multi-Input NAND PAC
NAND Type I PAC
NAND Type II PAC
Expandable NAND PAC
Octal/Decimal Decoder PAC
Power Amplifier PAC
Power Amplifier PAC
Transfer Gate PAC
,:c
Used for 4K Memories Only
*,:CUsed for
BK
Memories Only
***Six are required for an SK Memory
1-10
Quantity
6
l
l
1
16
8
l
l
3
l
5
6
l
l
3
1
6
2
2
34
1
7
8
13
4
2
4
5
6
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