Mounting Conditions; Recommended Soldering Condition (Through Holes); Wave Soldering; Hand Soldering - Renesas R-IN32M3 User Manual

R-IN32M3 Module

Mounting Conditions

6.

6.1 Recommended Soldering Condition (Through Holes)

Wave Soldering

6.1.1
The recommended temperature profile by wave soldering is shown below.
Maximum temperature (solder temperature): 260°C or below
Time at maximum temperature: 10 sec. or less
Preheating temperature: 140°C or below
Preheating time: 80 sec. or less
Maximum number of flow processes: 1 time

Hand Soldering

6.1.2
The following conditions are recommended for hand soldering.
•
350°C ± 5°C
•
Within 3 seconds per lead

Reflow Soldering

6.1.3
This product does not support reflow soldering.
Note:
Since the solder melting temperature varies depending on the board and solder material used, confirm
the optimum temperature that meets the recommended conditions regarding to the temperature profile
for wave soldering.
R19UH0111ED0100 Rev.1.00
June 30, 2020
6. Mounting Conditions
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