Layout Design Guideline - Renesas R-IN32M3 User Manual

R-IN32M3 Module

5.4 Layout Design Guideline

The following figure shows the footprints needed to implement the R-IN32M3 Module. Gray
areas indicate through holes and red areas indicate land patterns. The R-IN32M3 Module
mounting surface should be solid ground except in the wiring lead-out parts. No restrictions
apply to the inner layers of the P.C.B. The thickness of the P.C.B should be 1.6 mm. Any
mounting of components on the back side of the R-IN32M3 Module is prohibited.
R19UH0111ED0100 Rev.1.00
June 30, 2020
Figure 5.5 Footprint Drawing (Top View)
5. Guideline
Top View
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