Table Of Contents - Renesas R-IN32M3 User Manual

1. Overview ........................................................................................................................ 9
1.1 Features .................................................................................................................................................... 9
1.1.1 Applications .................................................................................................................................... 9
1.2 Functions.................................................................................................................................................... 9
1.3 Product Description ............................................................................................................................... 10
1.3.1 Product Name ............................................................................................................................... 10
1.3.2 Ordering Information ................................................................................................................... 10
2. Host Interface .............................................................................................................. 11
2.1 Overview ................................................................................................................................................. 11
2.2 Module Pins ............................................................................................................................................ 12
2.3 SPI Specification .................................................................................................................................... 14
2.4 Control Reset ......................................................................................................................................... 16
2.5 Sequence of Supplying and Cutting off Power................................................................................... 17
2.6 EtherCAT Sync Outputs ........................................................................................................................ 17
3. Network Interface Specification ................................................................................. 18
3.1 Overview ................................................................................................................................................. 18
3.2 Hardware Specification ......................................................................................................................... 18
3.3 LED Status Specification ...................................................................................................................... 19
3.4 PROFINET ............................................................................................................................................... 19
3.5 EtherNet/IP .............................................................................................................................................. 19
4. Electrical Characteristics ........................................................................................... 20
4.1 Absolute Maximum Ratings .................................................................................................................. 20
4.2 Operating Conditions ............................................................................................................................ 21
4.3 Functional Earth and Shielding ............................................................................................................ 21
4.4 Shock and Vibration .............................................................................................................................. 21
4.4.1 Vibration Test ............................................................................................................................... 21
4.4.2 Shock Test .................................................................................................................................... 21
4.4.3 Drop Test ....................................................................................................................................... 21
5. Guideline ...................................................................................................................... 22
5.1 Overview ................................................................................................................................................. 22
5.2 Circuit Design Guideline ....................................................................................................................... 22
5.2.1 Overview ....................................................................................................................................... 22
5.2.2 Power Supply................................................................................................................................ 22
5.2.3 Reset Circuit Example ................................................................................................................. 23
5.2.4 Host CPU Specifications ............................................................................................................. 23
5.3 Industrial Ethernet Protocol Indication ............................................................................................... 24
5.3.1 PROFINET ..................................................................................................................................... 25
5.3.2 EtherNet/IP .................................................................................................................................... 27
5.4 Layout Design Guideline ....................................................................................................................... 30
6. Mounting Conditions .................................................................................................. 31
6.1 Recommended Soldering Condition (Through Holes) ....................................................................... 31
6.1.1 Wave Soldering ............................................................................................................................ 31
6.1.2 Hand Soldering ............................................................................................................................. 31
6.1.3 Reflow Soldering .......................................................................................................................... 31
6.2 Storage Conditions of the Products without Moisture-Proof Packing ............................................. 32

Table of Contents