Dip Switch S10 Configuration Options - Intrinsyc Open-Q 660 User Manual

Open-Q™ 660 HDK Hardware Development Kit based on the Snapdragon™ 660 processor User Guide Version 1.0
Dimensions
Form Factor
Major Interfaces
Thermal

3.8.1 Dip switch S10 Configuration Options

There is a DIP switch S2301 on the south top side of the Open-Q 660 carrier board. The 8-bit
switch allows the user to control the system configuration and boot options. Table 3.8-1 below
outlines the pin outs and connections of this DIP switches.
Table 3.8-1 Open-Q 660 Carrier Board Mechanical Properties
2
289 cm (170mm x 170mm)
Mini-ITX
Carrier board: 2x240 pin board to board connector
Display: 100 pin board to board connector
Thermal pad is placed between the Carrier board and carrier board
Figure 6 Open- Q™ 660 Carrier Board
Copyright Intrinsyc Technologies Corporation
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