Quectel FG50V Hardware Design page 6

4.2. Electrical Characteristics ........................................................................................................................ 38
4.3. I/O Interface Characteristics .................................................................................................................. 39
4.4. Operating and Storage Temperatures .................................................................................................... 40
4.5. Current Consumption ............................................................................................................................ 40
4.5.1. Current Consumption in Low Power Modes .............................................................................. 40
4.5.2. Current Consumption in Normal Operation .............................................................................. 41
4.6. RF Performances .................................................................................................................................... 42
4.6.1. Conducted RF Output Power ..................................................................................................... 42
4.6.2. Conducted RF Receiving Sensitivity ........................................................................................... 44
4.7. Electrostatic Discharge ........................................................................................................................... 45
5 Mechanical Dimensions .......................................................................................................................... 47
5.1. Mechanical Dimensions of the Module ................................................................................................. 47
5.2. Recommended Footprint ....................................................................................................................... 49
5.3. Top and Bottom Views of the Module ................................................................................................... 50
Storage, Manufacturing and Packaging ................................................................................................... 51
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6.1. Storage ................................................................................................................................................... 51
6.2. Manufacturing and Soldering ................................................................................................................ 52
6.3. Packaging ............................................................................................................................................... 53
Appendix References .............................................................................................................................. 54
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FG50V_Hardware_Design
Wi-Fi&BT Module Series
FG50V Hardware Design
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