Quectel FG50V Hardware Design page 8

Wi-fi&bt module series
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Wi-Fi&BT Module Series
FG50V Hardware Design
Figure Index
Figure 1: Functional Diagram of FG50V Module........................................................................................................ 14
Figure 2: Pin Assignment (Top View) ......................................................................................................................... 16
Figure 3: Reference Circuit of power supply from SDX55 platform ........................................................................... 22
Figure 4: WLAN Interface Connection ....................................................................................................................... 23
Figure 5: PCIe Interface Connection .......................................................................................................................... 25
Figure 6: Block Diagram of BT Interface Connection ................................................................................................. 26
Figure 7: PCM Interface Connection .......................................................................................................................... 28
Figure 8: Coexistence Interface Connection .............................................................................................................. 29
Figure 9: SW_CTRL Connection ................................................................................................................................. 30
Figure 10: Reference Circuit for RF Antenna Interfaces ............................................................................................. 33
Figure 11: Microstrip Design on a 2-layer PCB........................................................................................................... 33
Figure 12: Coplanar Waveguide Design on a 2-layer PCB .......................................................................................... 34
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ........................................ 34
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ........................................ 34
Figure 15: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................................. 36
Figure 16: Mechanicals of UF.L-LP Connectors (Unit: mm) ........................................................................................ 36
Figure 17: Space Factor of Mated Connector (Unit: mm) .......................................................................................... 37
Figure 18: FG50V Top and Side Dimensions (Top and Side View) ............................................................................. 47
Figure 19: FG50V Bottom Dimension (Bottom View) ................................................................................................ 48
Figure 20: Recommended Footprint (Top View) ....................................................................................................... 49
Figure 21: Top View of the Module ........................................................................................................................... 50
Figure 22: Bottom View of the Module ..................................................................................................................... 50
Figure 23: Recommended Reflow Soldering Thermal Profile .................................................................................... 52
FG50V_Hardware_Design
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