Quectel FG50V Hardware Design page 35

Figure 12: Coplanar Waveguide Design on a 2-layer PCB
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
To ensure RF performance and reliability, the following principles should be complied with in RF layout design:

Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to
50 Ω.

The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.

The distance between the RF pins and the RF connector should be as short as possible, and all the
right-angle traces should be changed to curved ones. The recommended trace angle is 135°.

There should be clearance under the signal pin of the antenna connector or solder joint.

The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
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