Specifications; Feature List; Table 3 Feature Summary - Congatec COM Express conga-TCV2 User Manual

2

Specifications

2.1

Feature List

Table 3 Feature Summary
Form Factor
SoC
Memory
Chipset
Audio
Ethernet
Graphics Options
Peripheral Interfaces
BIOS
Power Management
cBC
Security
Copyright © 2021 congatec GmbH
Based on COM Express™ standard pinout Type 6 (Compact size 95 x 95 mm)
AMD Ryzen™ Embedded V2000
Two memory sockets (located on the top and bottom side of the conga-TCV2). Supports:
SO-DIMM ECC/non-ECC DDR4 memory modules
-
Data rates up to 3200 MT/s
-
Maximum 64 GB capacity (32 GB on each socket)
-
Integrated in the SoC
High Definition Audio (HDA) interface
2.5 Gigabit Ethernet controller (Intel i225V)
AMD Radeon™ Graphics supports:
API (DirectX 12, EGL 1.4, OpenCL
®
-
Multimedia hardware accelerator supporting H.264/AVC (8-bit) encode and decode, H.265/HEVC (8-bit and 10-bit) encode and decode,
-
VP9 (8-bit and 10-bit) decode, MS compliant JPEG encode and decode
Up to four independent displays (see table 8 "Display Combinations and Resolution")
-
3x DP++
1x LVDS/eDP 1.3
PEG x8 port
Resolutions up to 4K @ 60 Hz
4x USB 3.1 Gen 2
4x USB 2.0
2x SATA ® (6 Gbps )
5x PCIe (8 Gen. 3 lanes)
2x UART (16C550 compatible)
AMI Aptio V UEFI 2.x firmware
®
32 MB serial SPI flash with congatec Embedded BIOS features
ACPI 5.0 compliant with battery support.
S5e mode (see section 7.1.7 "Enhanced Soft-Off State")
Suspend to RAM (S3)
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control,
I2C bus, Power loss control
Discrete SPI TPM (Infineon SLB9670VQ2.0); AES Instructions
2.1, OpenGL ES (1.1, 2.x and 3.x), OpenGL
® ®
NOTE:
The conga-TCV2 does not natively support TMDS. A DP++ to TMDS
converter (e.g. PTN3360D) needs to be implemented on the carrier
board.
GPIOs
LPC
I²C (fast mode, multi-master)
SMB
SPI
TCV2m01
Next, OpenGL 4.6)
® ®
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