Installation; Mechanical; Electrical; Environmental - Emerson Rosemount WPG Reference Manual

Wireless pressure gauge with wirelesshart protocol
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Reference Manual
00809-0100-4045, Rev AB
2.3.2

Installation

Measurement performance depends upon proper installation of the device and impulse
piping. Mount the device close to the process and use a minimum of piping to achieve best
performance. Also, consider the need for easy access, personnel safety, and a suitable
device environment. Install the device to minimize vibration, shock, and temperature
fluctuation.
2.3.3

Mechanical

Location
When choosing an installation location and position, take into account the direction of the
device for future access to the COMM connections and readability of the analog display.
Electronics cover
The electronics cover is tightened so that polymer contacts polymer. When removing the
electronics cover, ensure that there is no damage done to the o-ring. If damaged replace
before reattaching cover, ensuring polymer contacts polymer (i.e. no O-ring visible).
2.3.4

Electrical

Battery
The Rosemount Wireless Pressure Gauge is self-powered. The battery contains
approximately five grams of lithium. Under normal conditions, the battery materials are
self-contained and are not reactive as the as the battery is maintained inside the enclosure
of the device. Care should be taken to prevent thermal, electrical, or mechanical damage.
Contacts should be protected to prevent premature discharge.
Use caution when handling the battery, it may be damaged if dropped.
The battery should be stored in a clean dry area, For maximum battery life, storage
temperature should not exceed 86 °F (30 °C).
2.3.5

Environmental

Verify the operating atmosphere of the device is consistent with the appropriate hazardous
locations certifications.
Temperature effects
The device will operate within specifications for ambient temperatures as outlined on
page 42
housing. If the process temperature is high, the ambient temperature will need to be lower
to account for heat transferred to the device housing. See
temperature derating.
Hardware Installation
in the specifications section. Heat from the process is transferred to the device
Hardware Installation
March 2016
Temperature limits
for process
7

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