Supermicro SuperServer 6029TP-HTR User Manual page 16

SuperServer 6029TP-HTR/HC0R/HC1R User's Manual
Overview of the Processor Heatsink Module (PHM)
The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) the SKX(-F) processor.
1. Heatsink
2. Narrow processor clip
3. SKX(-F) Processor
Processor Heatsink Module (PHM)
(Bottom View for a non-F Model)
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(Bottom View for an F Model)
Chapter 3: Maintenance and Component Installation
Attaching the Non-F Model Processor to the Narrow Processor Clip to
Create the Processor Package Assembly
To properly install the CPU into the narrow processor clip, please follow the steps below.
1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.
2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.
3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and
sliding notch C of the CPU into notch C of the processor clip.
4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.
Note: Please exercise extreme caution when handling the CPU. Do not touch the CPU
LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD gloves when
handling components.
C
CPU (Upside Down)
Align Notch C of the CPU
w/CPU LGA Lands up
and Notch C of the Processor Clip
B
A
Pin 1
C
Align Notch B of the CPU
and Notch B of the Processor Clip
CPU/Heatsink Package
B
(Upside Down)
Align CPU Pin 1
A
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Allow Notch C to
latch on to CPU
C
B
Allow Notch B to
latch on to CPU
A
Processor Package Carrier (w/CPU mounted
on the Processor Clip)