Attention: File System Risk Statement; Confirm How You Got To This Power 775 De Chassis Replace Service Procedure; Disk Enclosure Chassis Description - IBM Power775 Service Procedure

Disk enclosure chassis service procedure
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2.2

ATTENTION: File System Risk Statement

The Global Parallel File System (GPFS) implementation of software RAID stripes data across all the Disk
Enclosures in the cluster. If a single Disk Enclosure is powered off while GPFS is active, the file system
will go into panic and become unavailable.
This service procedure requires powering off a Disk Enclosure and because of this requires the customer to
shut down GPFS.
2.3
Confirm how you got to this Power 775 DE Chassis Replace
Service Procedure
You should be performing this procedure if you are working on a DE with a damaged chassis or a shorted
power domain that has been diagnosed to be on the internal cards in the DE chassis.
You must contact Product Engineering (PE) for approval and have a new chassis and transfer cart shipped to
the customer's location where the damaged DE chassis is located.
You should have downloaded this procedure from:
InfoCenter Website:
http://publib.boulder.ibm.com/infocenter/powersys/v3r1m5/topic/p7ee2/p7ee2kickoff.htm
This is the only valid source for the latest Power775 DE Chassis Service Procedure.
2.4

Disk Enclosure Chassis Description

The Disk Enclosure Chassis contains the following internal parts that are not replaceable in the field:
a.
b.
c.
The Disk Enclosure Chassis has been designed to withstand many faults, so a chassis replacement should
almost never be required. The only faults requiring a chassis replacement are:
a.
A short in the power distribution system that is confirmed to be present on one of the internal
printed circuit boards
b.
Physical damage that prevents the plugging of a DE DCCA, DE Fan, Drive Carrier or Port Card
All DE Chassis service events must be reviewed by PE (Product Engineering) before a replacement DE
Chassis is ordered.
Power775 Disk Enclosure Chassis Service Procedure
One metal chassis
Three backplane printed circuit boards
One Water/Air Heat Exchanger
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