Quectel LTE-A Series Hardware Design page 9

LTE-A Module Series
EG060V-EA Hardware Design
Figure 42: Bottom Dimensions (Bottom View) of the Module .................................................................... 73
Figure 43: Recommended Footprint (Top View) ........................................................................................ 74
Figure 44: Top View of the Module ............................................................................................................ 75
Figure 45: Bottom View of the Module ....................................................................................................... 75
Figure 46: Recommended Reflow Soldering Thermal Profile ................................................................... 78
Figure 47: Tape Specifications................................................................................................................... 79
Figure 48: Reel Specifications ................................................................................................................... 79
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