Quectel LTE-A Series Hardware Design page 71

Below are two reference designs of heatsink. You can choose one or both of them according to
application structures.
Application Board
Figure 39: Reference Design of Heatsink (Heatsink at the Top of the Module)
Module
Application Board
Figure 40: Reference Design of Heatsink (Heatsink at the Backside of PCB)
NOTES
1. Make sure that your PCB design provides sufficient cooling for the module: proper mounting,
heatsinks, and active cooling may be required depending on the integrated application.
2. To protect components from being damaged, the thermal design should be optimized to the largest
EG060V-EA_Hardware_Design
Module
Thermal Pad
Shielding Cover
Thermal Pad
Heatsink
Thermal Pad
Heatsink
Shielding Cover
LTE-A Module Series
EG060V-EA Hardware Design
Heatsink
Application Board
Heatsink
Application Board
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