Quectel LTE-A Series Hardware Design page 79

Temp. (°C)
246
238
220
200
Soak Zone
150
100
Figure 46: Recommended Reflow Soldering Thermal Profile
Table 37: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 ° C and 200 ° C)
Reflow Zone
Max slope
Reflow time (D: over 220° C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
EG060V-EA_Hardware_Design
A
Max slope: 1~3 °C/s
LTE-A Module Series
EG060V-EA Hardware Design
Reflow Zone
Max slope:
C
2~3 °C/s
B
D
Recommendation
1–3 ° C/s
70–120 s
2–3 ° C/s
45–70 s
238 ° C to 246 ° C
-1.5 to -3 ° C/s
1
Cooling down slope:
-1.5 ~ -3 °C/s
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