Usb Interface - Quectel LTE-A Series Hardware Design

In order to enhance the reliability and usability of the (U)SIM card in use, please follow the criteria below
in (U)SIM circuit design:
⚫
Place the (U)SIM card connector to the module as close as possible. Keep the trace length as less
than 200 mm as possible.
⚫
Keep (U)SIM card signals away from RF and VBAT traces.
⚫
Make the ground between module and (U)SIM card connector short and wide. Keep the trace width
of ground and USIM_VDD no less than 0.5 mm to avoid any decrease in electric potential.
⚫
To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫
To offer better ESD protection, add a TVS diode array whose parasitic capacitance is within 15 pF.
To facilitate debugging, add 22 ohm resistors in series between module and (U)SIM card.
Additionally, keep the (U)SIM peripheral circuit close to the (U)SIM card connector.
⚫
The pull-up resistor on USIM_DATA line can improve anti-jamming capability in sensitive occasions
or when long traces are applied, and should be placed close to the (U)SIM card connector.

3.10. USB Interface

EG060V-EA provides one integrated Universal Serial Bus (USB) interface which complies with the USB
2.0 specifications and supports high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The
USB interface can only serve as a slave component and is used for AT command communication, data
transmission, software debugging and firmware upgrading.
The following table shows the pin definition of USB interface.
Table 10: Pin Definition of USB Interface
Pin Name Pin No.
USB_DP 34
USB_DM 33
USB_VBUS 32
USB_ID* 36
OTG_PWR_EN* 143
GND 35
EG060V-EA_Hardware_Design
I/O Description
IO USB 2.0 differential data (+)
IO USB 2.0 differential data (-)
PI USB connection detect
DI USB ID detect
DO OTG power control
Ground
LTE-A Module Series
EG060V-EA Hardware Design
Comment
Require a differential
impedance of 90 Ω
Typical 5.0 V
40 / 82