Storage, Manufacturing And Packaging; Storage - Quectel LTE-A Series Hardware Design

7
Storage, Manufacturing and
Packaging

7.1. Storage

EG060V-EA is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity
should be 35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
humidity is below 60%. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
⚫
The module is not stored in Recommended Storage Condition;
⚫
Violation of the third requirement above occurs;
⚫
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫
Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
⚫
The module should be baked for 8 hours at 120 ± 5 ° C;
⚫
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
EG060V-EA_Hardware_Design
1)
in a plant where the temperature is 23 ± 5 ° C and relative
LTE-A Module Series
EG060V-EA Hardware Design
76 / 82