Processor Heat Sink Module (Phm) Assembly; Figure 34. Processor Components And Processor Socket Reference Diagram - Intel D40AMP Series Integration And Service Manual

Figure 34. Processor Components and Processor Socket Reference Diagram

3.5.1

Processor Heat Sink Module (PHM) Assembly

Required Tools and Supplies:
• Anti-static wrist strap and conductive workbench pad (recommended)
• ESD Gloves (recommended)
• T-30 Torx* screwdriver
Required Components:
• 3 rd Gen Intel® Xeon® Scalable processor in a shipping tray
• Processor carrier clip
• Processor heat sink with thermal interface material (TIM) pad
To properly assemble the PHM and install it onto the server board, the procedures described in the next
sections must be followed in the order specified. These instructions assume that the processor heat sink
(new or existing) has the necessary Thermal Interface Material (TIM) pad (Honeywell™ PTM7000) already
applied to the clean bottom surface of the heat sink.
Caution: Full ESD precautions should be followed to perform assembly of the PHM and installation of the
PHM to the server board. At no time should the processor itself be handled.
Each component within the PHM assembly includes a Pin 1 indicator. Pin 1 indicator alignment between all
components is required throughout the assembly process.
Intel® Server D40AMP Family Integration and Service Guide
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