Processor Support; Processor Socket And Processor Heat Sink Module (Phm) Assembly; Figure 14. Processor Heat Sink Module (Phm) Components And Processor Socket Reference Diagram - Intel S2600WF Technical Product Specification

Intel® Server Board S2600WF Product Family Technical Product Specification
3.

Processor Support

The server board includes two Socket-P LGA3647 processor sockets compatible with the Intel® Xeon®
processor Scalable family (standard and fabric options) and supports processor thermal design power (TDP)
of up to 205 W.
Note: Previous-generation Intel® Xeon® processors and their supported CPU heat sinks are not compatible
on server boards described in this document.
Note: The server board is capable of supporting processors with a maximum 205 W TDP. However, TDP
support may vary depending on the cooling capabilities of the chosen server chassis. Check the server
chassis or server system product specifications to determine maximum supported processor TDP.
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3.1

Processor Socket and Processor Heat Sink Module (PHM) Assembly

This generation server board introduces the concept of the processor heat sink module (PHM). Figure 14
identifies each component associated with the processor assembly. The illustration does not represent the
processor installation process.

Figure 14. Processor heat sink module (PHM) components and processor socket reference diagram

Processor installation requires that the processor be attached to the processor heat sink prior to installation
onto the server board.as shown in Figure 15.
for a complete list of supported processors.
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