Sagem myC-4 Site Technical Documentation page 98

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myC-4
Electronic board exchange process
Mobile phone with deffect on
PCB
Remove the defect
electronic board
Proc 1.03
Replace the electronic
swap board in the hanset
(Check the reference
25M)
Follow the SMT swap
instructions
Standard tests
Tests OK
YES
wavetek tests
Tests OK
YES
Back to customer
________________________________________________________________________________________________
Ref. SCT U38 SSC DTS 0023 – Index B - February 21, 2005
EQUIPPED ELECTRONIC BOARD EXCHANGE
NO
Check the assembly
Assembly
OK
NO
YES
Shipment of defective
boards to SAGEM
NO
YES
Proc sheet 1 15
3/3
Detection of N3 defect : See
the Technical documentation
-Check oxidation under
the metal dome .
- Audio parameters
written on the new
swap board
- Display test : Hot Line Menu
- Keypad test
- Vibrating device test
- See Technical
documentation (test sheet 05)
- Follow return instructions
page 5-39
Page 5-45

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