B-22. Msp-Ts430Pz100 Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430PZ100
Pos. Ref Des
1 C1, C2,
1b C3, C4
2 C6, C7
3 C5
4 C8
5 C9
6 D1
J1, J2, J3,
7
J4
8 J5
9 J6, J7
10
11 JTAG
12 BOOTST
13 Q1, Q2
14 R3
R1, R2, R4,
15 R8, R9, R10,
R11, R12
16 R5
17 U1
18 PCB
Adhesive
19
Plastic feet
20 MSP430
98
Hardware
Table B-22. MSP-TS430PZ100 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
1 10uF/10V, Tantal Size B
1 100nF, SMD0805
1 10nF, SMD0805
1 470nF, SMD0805
1 yellow LED, TH, 3mm, T1
0 25-pin header, TH
1 3-pin header, male, TH
2 2-pin header, male, TH
2 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 10-pin connector, male, TH
0 Crystal
1 330 Ω, SMD0805
3 0 Ω, SMD0805
47k Ω, SMD0805
1
"Socket: IC201-1004-008or
1
IC357-1004-53N"
1 82 x 90 mm
4 ~6mm width, 2mm height
2 MSP430FG4619IPZ
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP: Only
recommendation. Check
your crystal spec.
511-1463-2-ND DNP: C6
478-3351-2-ND
478-1383-2-ND
478-1403-2-ND
511-1251-ND
DNP: Headers and
receptacles enclosed with
SAM1029-25-NDSAM1213-
kit.Keep vias free of
25-ND
solder.: Header:
Receptacle
SAM1035-03-ND
SAM1035-02-ND place jumper on header
15-38-1024-ND Place on: J6, J7
DNP: Keep vias free of
solder
Q1: Micro Crystal
DNP: Keep vias free of
MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
541-330ATR-ND
541-000ATR-ND DNP: R4, R9, R10, R12
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part No. Apply to corners at bottom
SJ-5302 side
DNP: enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
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