B-21. Msp-Ts430Pn80Usb Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430PN80USB
Pos. Ref Des
1 C1, C2
1.1 C3, C4
2 C6, C7
C5, C11,
3
C13, C14
3.1 C10, C12
4 C8
5 C9
6 D1
J1, J2, J3,
7
J4
7.1
8 J5
JP5, JP6,
JP7,
9
JP8,JP9,
JP10
10 JP1, JP2
JP4
11 JP3
12
13 JTAG
14 Q1
15 Q2
16 R3, R7
R1, R2, R4,
17 R6, R8, R9,
R12
18 R10
18 R11
18 R5
19 U1
20 PCB
Rubber
21
standoff
22 MSP430
Insulating
23
disk to Q2
27 C33
28 C35
94
Hardware
Table B-21. MSP-TS430PN80USB Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
2 47pF, SMD0805
2 10uF/6.3V, Tantal Size B
4 100nF, SMD0805
0 10uF, SMD0805
1 2.2nF, SMD0805
1 470nF, SMD0805
1 green LED, SMD0805
4 20-pin header, TH
4 20-pin header, TH
1 3-pin header, male, TH
6 3-pin header, male, TH
2 2-pin header, male, TH
1
1 3-pin header, male, TH
10 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 Crystal
1 Crystal
2 330 Ω, SMD0805
2 0 Ω, SMD0805
1 100 Ω, SMD0805
0 1M Ω, SMD0805
1 47k Ω, SMD0805
1 Socket:IC201-0804-014
1 79 x 77 mm
4
2 MSP430F5529
1 Insulating disk to Q2
1 220n
1 10p
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP: C1, C2
511-1463-2-ND
311-1245-2-ND
311-1245-2-ND DNP: C10, C12
478-1403-2-ND
P516TR-ND
DNP: headers and
receptacles enclosed with
SAM1029-20-ND kit. Keep vias free of
solder.: Header:
Receptacle
DNP: headers and
receptacles enclosed with
SAM1213-20-ND kit. Keep vias free of
solder.: Header:
Receptacle
SAM1035-03-ND
SAM1035-03-ND Place jumpers on pins 2-3
SAM1035-02-ND Place jumper on header
Place jumper only on one
SAM1035-02-ND
pin
SAM1035-03-ND Place jumper on pins 1-2
Place on: JP1, JP2, JP3,
15-38-1024-ND JP4, JP5, JP6, JP7, JP8,
JP9, JP10
Micro Crystal MS1V-T1K
DNP: Q1 Keep vias free of
32.768kHz, C(Load) =
solder
12.5pF
"Q2: 4MHzBuerklin:
78D134"
541-330ATR-ND
541-000ATR-ND DNP: R4, R6, R8, R9, R12
Buerklin: 07E500
DNP
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
Apply to corners at bottom
Buerklin: 20H1724
side
DNP: Enclosed with kit
supplied by TI
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
Buerklin: 53D2074
Buerklin: 56D102
SLAU278F – May 2009 – Revised December 2010
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