B-24. Msp-Ts430Pz100B Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430PZ100B
Position Ref Des
1 C1, C2
C4, C5, C6
2 , C7, C8,
C9
3 C10, C26
4 C11, C12
C13, C14,
5 C16, C18,
C19, C29
6 D1
J1, J2, J3,
7
J4
8 J5
JP3, JP5,
JP6, JP7,
9
JP8, JP9,
JP10
JP1, JP2,
10
JP4
JP11,
11
JP12, JP13
12
15 JTAG
16 BOOTST
17 Q1
21 R3, R7
R1, R2,
R4, R6,
22
R8, R10,
R11
23 R5
24 U1
25 PCB
Adhesive
26
plastic feet
27 MSP430
104
Hardware
Table B-24. MSP-TS430PZ100B Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
6 100nF, SMD0805
2 470 nF, SMD0805
1 10 uF / 6.3 V SMD0805
6 4.7 uF SMD0805
1 green LED, SMD0805
0 25-pin header, TH
1 3-pin header, male, TH
7 3-pin header, male, TH
3 2-pin header, male, TH
3 4-pin header, male, TH
13 Jumper
14-pin connector, male,
1
TH
10-pin connector, male,
0
TH
0 Crystal
2 330 Ω, SMD0805
2 0 Ohm, SMD0805
1 47k Ω, SMD0805
1 Socket: IC357-1004-53N
1 90 x 82 mm
about 6mm width, 2mm
4
height
2 MSP430F6733IPZ
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
311-1245-2-ND
478-1403-2-ND
C12 DNP
P516TR-ND
SAM1029-25-ND
DNP: Headers and receptacles
(Header)
enclosed with kit. Keep vias free of
SAM1213-25-ND
solder:
(Receptacle)
place jumpers on pins 2-3 on JP5,
SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
SAM1035-02-ND Place jumper on header
place jumper on header 1-2
15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
HRP14H-ND
"DNP Keep vias free of solder"
DNP: Q1 Keep vias free of solder
541-330ATR-ND
541-000ATR-ND DNP: R4, R6, R8, R10, R11
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
www.ti.com
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