B-23. Msp-Ts430Pz100A Bill Of Materials - Texas Instruments MSP430 User Manual

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Pos. Ref Des
1 C1, C2
1b C3, C4
2 C7, C9
C5, C11,
3
C14
4 C8
5 C6
6 D1
J1, J2, J3,
7
J4
8 J5
10 JP1, JP2
11 JP3
12
13 JTAG
14 BOOTST
15 Q1, Q2
16 R3
R1, R2, R4,
R6, R7, R8,
17
R9, R10,
R11, R12
18 R5
19 U1
20 PCB
Rubber
21
standoff
22 MSP430
SLAU278F – May 2009 – Revised December 2010
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Table B-23. MSP-TS430PZ100A Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
2 10uF/10V, Tantal Size B
3 100nF, SMD0805
1 10nF, SMD0805
0 470nF, SMD0805
1 green LED, SMD0805
0 25-pin header, TH
1 3-pin header, male, TH
2 2-pin header, male, TH
1 3-pin header, male, TH
3 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 10-pin connector, male, TH
0 Crystal
1 330 Ω, SMD0805
2 0 Ω, SMD0805
1 47k Ω, SMD0805
1 Socket: IC357-1004-53N
1 90 x 82 mm
4
2 MSP430F5438IPZ
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP: Only
recommendation. Check
your crystal spec.
511-1463-2-ND
311-1245-2-ND
478-1358-1-ND
478-1403-2-ND DNP
67-1553-1-ND
DNP: Headers and
receptacles enclosed with
SAM1029-25-NDSAM1213-
kit.Keep vias free of
25-ND
solder.: Header:
Receptacle
SAM1035-03-ND
SAM1035-02-ND pPlace jumper on header
SAM1035-03-ND Place jumper on pins 1-2
15-38-1024-ND Place on: JP1, JP2, JP3
DNP: Keep vias free of
solder
Q1: Micro Crystal
DNP: Keep vias free of
MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
541-330ATR-ND
DNP: R4, R6, R7, R8, R9,
541-000ATR-ND
R10, R11, R12
541-47000ATR-ND
Manuf.: Yamaichi
4 layers
Apply to corners at bottom
Select appropriate
side
DNP: Enclosed with kit
supplied by TI
MSP-TS430PZ100A
Comment
101
Hardware