B-13. Msp-Ts430Dl48 Bill Of Materials - Texas Instruments MSP430 User Manual

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Pos. Ref Des
1 C1, C2
2 C4, C7
3 C3, C5
4 C8
5 D1
6 J1, J2
7 J3, JP1, JP2
8 J4, J5
9
10 JTAG
11 BOOTST
12 Q1
13 R3
R4, R6, R7,
14
R12
15 R5
16 U1
17 PCB
Adhesive
18
Plastic feet
19 MSP430
SLAU278F – May 2009 – Revised December 2010
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Table B-13. MSP-TS430DL48 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
2 10uF/10V, Tantal Size B
2 100nF, SMD0805
1 10nF, SMD0805
1 yellow LED, TH, 3mm, T1
0 24-pin header, TH
2 3-pin header, male, TH
2 2-pin header, male, TH
3 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 10-pin connector, male, TH
0 Crystal
1 560 Ω, SMD0805
2 0 Ω, SMD0805
1 47k Ω, SMD0805
Socket: IC51-1387
1
KS-15186
1 58 x 66 mm
4 ~6mm width, 2mm height
2 MSP430F4270IDL
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
511-1463-2-ND
478-3351-2-ND
478-1383-2-ND
511-1251-ND
DNP: Headers and
receptacles enclosed with
SAM1034-12-NDSAM1212-
kit.Keep vias free of
12-ND
solder.: Header:
Receptacle
Place jumper on header
SAM1035-03-ND
JP1; Pos 1-2. DNP: JP2
SAM1035-02-ND Place jumper on header
15-38-1024-ND Place on: JP1, J4, J5
DNP: Keep vias free of
solder
Micro Crystal MS1V-T1K
DNP: Keep vias free of
32.768kHz, C(Load) =
solder
12.5pF
541-560ATR-ND
541-000ATR-ND DNP: R6, R7
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part No. Apply to corners at bottom
SJ-5302 side
DNP: Enclosed with kit
supplied by TI
MSP-TS430DL48
Comment
69
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