B-11. Msp-Ts430Rsb40 Bill Of Materials - Texas Instruments MSP430 User Manual

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Pos. Ref Des
1 C1, C2
C3, C7, C10,
2
C12
C4, C6, C8,
3
C11
4 C5
5 C9
6 D1
7 J1, J2, J3, J4
7.1
JP1,
JP4,JP5,
8 JP6, JP7,
JP8, JP9, J5,
JP10
9 JP2, JP3
10 JTAG
11 BOOTST
12 U1
13 Q1
15
16 R1,R7
R2, R3, R5,
17 R6, R8, R9,
R10
18 R4
19 MSP430
Rubber stand
20
off
SLAU278F – May 2009 – Revised December 2010
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Table B-11. MSP-TS430RSB40 Bill of Materials
No. Per
Description
Board
0 12pF, SMD0805
3 10uF/10V, SMD 0805
3 100nF, SMD0805
1 2.2nF, SMD0805
1 470nF, SMD0805
1 green LED, SMD0805
4 10-pin header, TH
4 10-pin header, TH
9 3-pin header, male, TH
2 2-pin header, male, TH
1 14-pin connector, male, TH
0 10-pin connector, male, TH
QFN-40B-0.4_
1
ENPLAS_SOCKET
0 Crystal
10 Jumper
2 330R SMD0805
3 0R SMD0805
1 47k SMD0805
2 MSP430F5132
4
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
445-1371-1-ND
311-1245-2-ND
P516TR-ND
receptacles enclosed with kit.
Keep vias free of solder. :
receptacles enclosed with kit.
Keep vias free of solder. :
Jumper: 1-2 on JP1, JP10;
SAM1035-03-ND
SAM1035-02-ND
HRP14H-ND
Enplas
Micro Crystal MS3V-T1R
DNP: Q1. Keep vias free of
32.768kHz, C(Load) =
12.5pF
Place on: JP1, JP2, JP3,
15-38-1024-ND JP4, JP5, JP6, JP7, JP8,
DNP: enclosed with kit. Is
select appropriate; e.g., apply to corners at bottom
Buerklin: 20H1724
MSP-TS430RSB40
Comment
DNP: C1, C2
DNP C12
DNP C11
DNP: headers and
Header : Receptacle
DNP: headers and
Header : Receptacle
2-3 on JP4-JP9
place jumper on header
DNP. Keep vias free of
solder
solder
JP9, JP10
DNP R2, R3, R5, R6
supplied by TI
side
63
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