Msp-Ts430L092 Bill Of Materials - Texas Instruments MSP430 User Manual

www.ti.com
Pos. Ref Des No.
1 C1, C2
2 C5
3 C6
4 C10
5 EEPROM1
7 J1, J2
8 J3
9 J4, J5
11 J13
12 JP1, JP2,JP3
15 L1
16 LED1, LED4
17 Q2
18 R0, R6, R7
19 R1
20 R2
R4,R5, R8,
21
R10, RC, RD
22 RA
23 RB
24 U1
22 MSP430
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Table B-2. MSP-TS430L092 Bill of Materials
No. Per
Description
Board
2 330nF, SMD0603
1 100n, SMD0603
1 10u, SMD0805
1 100n, SMD0603
1 M95512 SO08 (SO8)
2 7-pin header, TH
1 3-pin header, male, TH
2 FE4L, FE4H
1 MICRO_STECKV_10
3 2-pin header, male, TH
1 33uH, SMD0806
2 LEDCHIPLED_0603
1 BC817-16LT1SMD
3 2K7, SMD0603
1 1k, SMD0603
1 47k, SMD0603
6 10k, SMD0603
1 3.9k, SMD0603
1 6.8k, SMD0603
14 Pin Socket -
1
IC189-0142-146
2 MSP430L092PWR
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
ST Micro M95160R Digikey: 497-8688-1-ND
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
SAM1213-07-ND : Header
SAM1035-07-ND : Receptacle
SAM1035-03-ND
DNP; Keep vias free of
4 pol. Stiftreihe
solder.
Reichelt:
MicroMaTch-Connector: MM
FL 10G
SAM1035-02-ND place jumper on header
LQH2MCN330K02L Farnell: 151-5557
Farnell: 1686065
BC817-16LT1SMD SOT23-BEC
Manuf. Yamaichi
DNP: enclosed with kit. Is
supplied by TI
MSP-TS430L092
Comment
39
Hardware