B-19. Msp-Ts430Pn80 Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430PN80
Pos. Ref Des
1 C1, C2
1.1 C3, C4
2 C6, C7
3 C5
4 C8
5 D1
J1, J2, J3,
6
J4
7 J5, JP1
8 J6, JP2
9
10 JTAG
11 BOOTST
12 Q1, Q2
13 R3
R1, R2, R4,
14 R6, R7, R10,
R11, R12
15 R5
16 U1
17 PCB
Adhesive
18
Plastic feet
19 MSP430
88
Hardware
Table B-19. MSP-TS430PN80 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
1 10uF/10V, Tantal Size B
1 100nF, SMD0805
1 10nF, SMD0805
1 green LED, SMD0603
0 25-pin header, TH
2 3-pin header, male, TH
2 2-pin header, male, TH
3 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 10-pin connector, male, TH
0 Crystal
560 Ω, SMD0805
1
2 0 Ω, SMD0805
1 47k Ω, SMD0805
1 Socket: IC201-0804-014
1 77 x 77 mm
4 ~6mm width, 2mm height
2 MSP430FG439IPN
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP: C1, C2
DNP: Only
recommendation. Check
your crystal spec.
511-1463-2-ND
478-3351-2-ND
478-1383-2-ND
475-1056-2-ND
DNP: Headers and
receptacles enclosed with
SAM1029-20-NDSAM1213-
kit.Keep vias free of
20-ND
solder.: Header:
Receptacle
SAM1035-03-ND
SAM1035-02-ND Place jumper on header
Place on: J6, JP2,
15-38-1024-ND
JP1/Pos1-2
DNP: Keep vias free of
solder
Q1: Micro Crystal
DNP: Keep vias free of
MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
541-560ATR-ND
DNP: R4, R6, R7, R10,
541-000ATR-ND
R11, R12
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part No. Apply to corners at bottom
SJ-5302 side
DNP: Enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
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