B-26. Msp-Ts430Pz100Usb Bill Of Materials - Texas Instruments MSP430 User Manual

Texas instruments computer hardware user manual
Hide thumbs Also See for MSP430:
Table of Contents

Advertisement

MSP-TS430PZ100USB
Pos.
Ref Des
1
C1, C2
1.1
C3, C4
2
C6, C7
C5, C11,
3
C13, C14,
C19
C10, C12,
3.1
C18,17
4
C8
5
C9
6
D1
7
J1, J2, J3, J4
7.1
8
J5
JP5, JP6,
9
JP7, JP8,
JP9, JP10
JP1, JP2,
10
JP4
11
JP3
12
13
JTAG
14
Q1
15
Q2
16
R3, R7
R1, R2, R4,
17
R6, R8, R9,
R12
18
R10
18
R11
18
R5
19
U1
20
PCB
Rubber stand
21
off
22
MSP430
nsulating disk
23
to Q2
24
C16
27
C33
28
C35, C36
110 Hardware
Table B-26. MSP-TS430PZ100USB Bill of Materials
No. Per
Description
Board
0
12pF, SMD0805
2
47pF, SMD0805
2
10uF/6.3V, Tantal Size B
5
100nF, SMD0805
0
100nF, SMD0805
1
2.2nF, SMD0805
1
470nF, SMD0805
1
green LED, SMD0805
4
25-pin header, TH
4
25-pin header, TH
1
3-pin header, male, TH
6
3-pin header, male, TH
3
2-pin header, male, TH
1
3-pin header, male, TH
10
Jumper
1
14-pin connector, male, TH
0
Crystal
1
Crystal
2
330 Ω, SMD0805
3
0 Ω, SMD0805
1
100 Ω, SMD0805
1
1M Ω, SMD0603
1
47k Ω, SMD0805
1
Socket:IC201-1004-008
1
79 x 77 mm
4
2
MSP430F5529
1
Insulating disk to Q2
1
4.7 nF SMD0603
1
220n SMD0603
2
10p SMD0603
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP: C1, C2
511-1463-2-ND
311-1245-2-ND
311-1245-2-ND
DNP: C10, C12,C18, C17
478-1403-2-ND
P516TR-ND
DNP: headers and
receptacles enclosed with kit.
SAM1029-25-ND
Keep vias free of solder.
: Header
: Receptacle
DNP: headers and
receptacles enclosed with kit.
SAM1213-25-ND
Keep vias free of solder.
: Header
: Receptacle
SAM1035-03-ND
SAM1035-03-ND
place jumpers on pins 2-3
SAM1035-02-ND
place jumper on header
SAM1035-03-ND
place jumper on pins 1-2
Place on: JP1, JP2, JP3,
15-38-1024-ND
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
HRP14H-ND
Micro Crystal MS1V-T1K
DNP: Q1. Keep vias free of
32.768kHz, C(Load) =
solder
12.5pF
Q2: 4MHz, Buerklin: 78D134
541-330ATR-ND
541-000ATR-ND
DNP: R6, R8, R9, R12
Buerklin: 07E500
not existing in Rev 1.0
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
apply to corners at bottom
Buerklin: 20H1724
side
DNP: enclosed with kit. Is
supplied by TI
http://www.ettinger.de/Art_De
tail.cfm?ART_ARTNUM=70.0
8.121
Buerklin: 53D2074
Buerklin: 56D102
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
www.ti.com
Comment

Advertisement

Table of Contents
loading

Table of Contents