B-14. Msp-Ts430Rgz48B Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430RGZ48B
Position Ref Des
1 C1, C2
2 C3, C4
C6, C7,
3
C12
C5, C11,
4
C13, C14
5 C8
6 C9
7 D1
J1, J2, J3,
8
J4
9 J5
JP3, JP5,
JP6, JP7,
10
JP8, JP9,
JP10
11 JP1, JP2
12
13 JTAG
14 BOOTST
15 Q1
16 Q2
Insulating
17
disk to Q2
18 R3, R7
R1, R2,
R4, R6,
19 R8,
R9,R10,
R11, R12
20 R5
21 U1
22 PCB
Adhesive
23
plastic feet
24 MSP430
72
Hardware
Table B-14. MSP-TS430RGZ48B Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
3 10uF/6.3V, SMD0805
4 100nF, SMD0805
1 2.2nF, SMD0805
1 470nF, SMD0805
1 green LED, SMD0805
0 12-pin header, TH
1 3-pin header, male, TH
7 3-pin header, male, TH
2 2-pin header, male, TH
9 Jumper
14-pin connector, male,
1
TH
10-pin connector, male,
0
TH
0 Crystal
0 Crystal
0 Insulating disk to Q2
2 330 Ω, SMD0805
3 0 Ohm, SMD0805
1 47k Ω, SMD0805
Socket:
1 QFN11T048-
008_A101121_RGZ48
1 81 x 76 mm
about 6mm width, 2mm
4
height
2 MSP430F5342IRGZ
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP
311-1245-2-ND
478-1403-2-ND
P516TR-ND
SAM1029-12-ND
DNP: Headers and receptacles
(Header)
enclosed with kit. Keep vias free of
SAM1213-12-ND
solder:
(Receptacle)
place jumpers on pins 2-3 on JP5,
SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
SAM1035-02-ND Place jumper on header
15-38-1024-ND See Pos. 10and Pos. 11
HRP14H-ND
"DNP Keep vias free of solder"
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
541-330ATR-ND
541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
www.ti.com
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