B-15. Msp-Ts430Pm64 Bill Of Materials - Texas Instruments MSP430 User Manual

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Pos. Ref Des
1 C1, C2
1.1 C3, C4
2 C6, C7
3 C5
4 C8
5 C9
6 D1
J1, J2, J3,
7
J4
8 J5
9 J6, J7
11
12 JTAG
13 BOOTST
14 Q1, Q2
15 R3
R1, R2, R4,
R6, R7, R8,
16 R9, R10,
R11, R12,
R13, R14
17 R5
18 U1
19 PCB
Rubber
20
standoff
21 MSP430
SLAU278F – May 2009 – Revised December 2010
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Table B-15. MSP-TS430PM64 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
1 10uF/10V, Tantal Size B
1 100nF, SMD0805
1 10nF, SMD0805
1 470nF, SMD0805
1 green LED, SMD0805
0 16-pin header, TH
1 3-pin header, male, TH
2 2-pin header, male, TH
2 Jumper
1 14-pin connector, male, TH HRP14H-ND
0 10-pin connector, male, TH
0 Crystal
1 330 Ω, SMD0805
0 Ω, SMD0805
3
1 47k Ω, SMD0805
1 Socket: IC51-0644-807
1 78 x 75 mm
4
MSP430F2619IPM
22
MSP430F417IPM
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP: Only
recommendation. Check
your crystal spec.
511-1463-2-ND DNP: C6
478-3351-2-ND
478-1383-2-ND
478-1403-2-ND
P516TR-ND
DNP: Headers and
receptacles enclosed with
SAM1029-16-NDSAM1213-
kit.Keep vias free of
16-ND
solder.: Header:
Receptacle
SAM1035-03-ND
SAM1035-02-ND Place jumper on header
15-38-1024-ND Place on: J6, J7
DNP: Keep vias free of
solder
Q1: Micro Crystal
DNP: Keep vias free of
MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
541-330ATR-ND
DNP: R4, R6, R7, R9, R10,
541-000ATR-ND
R11, R12, R13, R14
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
Apply to corners at bottom
select appropriate
side
DNP: Enclosed with kit
supplied by TI
MSP-TS430PM64
Comment
75
Hardware