Msp-Ts430Dw28 Bill Of Materials - Texas Instruments MSP430 User Manual

MSP-TS430DW28
Position Ref Des
1 C1, C2
2 C5
3 C7
4 C8
5 D1
6 Q1
7 J1, J2
7.1
8 J3
9 J4, J5
10 BOOTST
11 JTAG
R1, R2,
R6, R7,
12
R8,R9,
R10, R11
13 R3
14 R5
15 U1
16 U2
48
Hardware
Table B-6. MSP-TS430DW28 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
1 100nF, SMD0805
1 10uF/10V Tantal Elko B
1 10nF
1 LED3 T1 3mm yellow
0 QUARZ, Crystal
2 14-pin header, TH male
14-pin header, TH
2
female
1 3-Pin Connector, male
2 2-Pin Connector, male
0 ML10, 10-Pin Conn., m
1 ML14, 14-Pin Conn., m
4 0R, SMD0805
1 560R, SMD0805
1 47K, SMD0805
1 SOP28DW socket
0 TSSOP
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP: C1, C2, Cover holes while
soldering
SMD0805
RS: 228-4991
Micro Crystal MS1V-T1K
32.768kHz, C(Load) = DNP: Cover holes while soldering
12.5pF
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.: Header: Receptacle
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.: Header: Receptacle
With jumper
RS: 482-115 DNP, Cover holes while soldering
RS: 482-121
DNP: R1, R2, R9, R10
Yamaichi:
IC189-0282-042
DNP
SLAU278F – May 2009 – Revised December 2010
www.ti.com
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