Msp-Ts430Pw28 Bill Of Materials - Texas Instruments MSP430 User Manual

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Pos. Ref Des
1 C1, C2
2 C3
3 C4
4 C5
5 D1
6 Q1
7 J1, J2
7.1
8 J5, IP1
JP1, JP4,
JP5, JP6,
8a
JP7, JP8,
JP9
9 JP2, JP3
10 BOOTST
11 JTAG
12 R1, R7
R2, R3, R5,
12
R6
14 R4
15 U1
(1)
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
SLAU278F – May 2009 – Revised December 2010
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Table B-7. MSP-TS430PW28 Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
1 10uF/10V Tantal Elko B
1 100nF, SMD0805
0 2.2nF, SMD0805
1 LED green SMD0603
0 QUARZ, Crystal
2 14-pin header, TH male
2 14-pin header, TH female
1 3-Pin Connector , male
7 3-Pin Connector , male
2 2-Pin Connector , male
0 ML10, 10-Pin Conn. , m
1 ML14, 14-Pin Conn. , m
2 330R, SMD0805
0 0R, SMD0805
1 47K, SMD0805
1 SOP28PW socket
© 2009–2010, Texas Instruments Incorporated
(1)
DigiKey Part No.
DNP: C1, C2 , Cover holes
while soldering
DNP
Micro Crystal MS1V-T1K DNP: Cover holes and
32.768kHz, C(Load) = neighboring holes while
12.5pF soldering
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of
solder.: Header:
Receptacle
DNP: headers and
receptacles enclosed with
kit.Keep vias free of
solder.: Header:
Receptacle
Jumper on Pos 1-2
with Jumper
DNP: Cover holes while
RS: 482-115
soldering
RS: 482-121
DNP
Enplas: OTS-28-0.65-01
MSP-TS430PW28
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