B-17. Msp-Ts430Rgc64B Bill Of Materials - Texas Instruments MSP430 User Manual

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Position Ref Des
1 C1, C2
2 C3, C4
C6, C7,
3
C10
C5, C11,
4 C13, C14,
C15
5 C8
6 C9
7 C16
8 C17
9 D1
J1, J2, J3,
10
J4
11 J5 , J6
JP3, JP5,
JP6, JP7,
12
JP8, JP9,
JP10
JP1, JP2,
13
JP4
14
15 JTAG
16 BOOTST
17 Q1
18 Q2
Insulating
19
disk to Q2
20 R3, R7
R1, R2,
R4, R6,
21 R8,
R9,R10,
R11, R12
22 R5
23 U1
24 PCB
Adhesive
25
plastic feet
26 D3,D4
27 MSP430
SLAU278F – May 2009 – Revised December 2010
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Table B-17. MSP-TS430RGC64B Bill of Materials
No. per
Description
Board
0 12pF, SMD0805
0 47pF, SMD0805
3 10uF/6.3V, SMD0805
5 100nF, SMD0805
1 2.2nF, SMD0805
1 470nF, SMD0805
1 4.7uF, SMD0805
1 220nF, SMD0805
1 green LED, SMD0805
0 16-pin header, TH
2 3-pin header, male, TH
7 3-pin header, male, TH
3 2-pin header, male, TH
10 Jumper
14-pin connector, male,
1
TH
10-pin connector, male,
0
TH
0 Crystal
0 Crystal
0 Insulating disk to Q2
2 330 Ω, SMD0805
3 0 Ohm, SMD0805
47k Ω, SMD0805
1
Socket:
1
QFN11T064-006-N-HSP
1 85 x 76 mm
about 6mm width, 2mm
4
height
2 MSP430F5310 RGC
© 2009–2010, Texas Instruments Incorporated
DigiKey Part No.
DNP
DNP
311-1245-2-ND
478-1403-2-ND
P516TR-ND
SAM1029-16-ND
DNP: Headers and receptacles
(Header)
enclosed with kit. Keep vias free of
SAM1213-16-ND
solder:
(Receptacle)
place jumpers on pins 2-3 on JP5,
SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
SAM1035-02-ND Place jumper on header
15-38-1024-ND See Pos. 12 and Pos. 13
HRP14H-ND
"DNP Keep vias free of solder"
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
541-330ATR-ND
541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
541-47000ATR-ND
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
DNP: enclosed with kit, supplied by TI
MSP-TS430RGC64B
Comment
81
Hardware