Figure 3-6 Recommended Desoldering Sequence - Tektronix 11A52 Service Manual

Maintenance
3
38
7
34
11
30
15
26
19
22
23
18
27
14
31
10
3
22
35
6
7
18
39
2
11
14
4
37
3
13
7
10
11
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4
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8 9
12
5
14
14-PIN
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10
8
33
3
14
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12
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10
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2
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25
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6 4
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20
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8 17
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13
8
9 16
9
32
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12
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20
5
36
5
16
24
40
306
7 2
4 5
8 1
8-PIN 16-PIN
24-PIN
40-PIN
7391-304
Figure 3-6. Recommended Desoldering Sequence.
Use wire solder with rosin core, 63% tin, 37% lead. Contact your local Tektronix, Inc. representative or field
office for approved solders.
The 11A52 Main board is a multi-layer board. Conductive paths between the top and bottom board layers may
connect with one or more of inner layers. If this inner conductive path is broken (due to poor soldering practices),
the board is unusable and must be replaced. Damage can void warranty.
CAUTION
Only an experienced maintenance person, proficient in the use of vacuum type desoldering equipment,
should attempt repair of any board in this plug-in.
When soldering on circuit boards or small wiring, use only a 15-watt, pencil-type soldering iron. A higher
wattage soldering irori can cause the etched circuit wiring to separate from the board base material, and melt
the insulation from small wiring. Always keep the soldering-iron tip properly tinned to ensure the best heat
transfer to the solder joint. Apply only enougn heat to make a good solder joint. To protect heat-sensitive
components, hold the component lead with a pair of long-nose pliers between the component body and the solder
joint.
Touch the tip of the vacuum desoldering tool directly to the solder to be removed.
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l 1A52 Extended Service Manual
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