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Specifications
A
EMC Regulatory Compliance
A-4
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow. It is important to note
that there are several factors, in addition to the rated CFM of the air mover,
which determine the actual volume and speed of air flowing over a
module.
The MVME2300SC was tested in an EMC-compliant chassis and meets
the requirements for Class B equipment. Compliance was achieved under
the following conditions:
Shielded cables on all external I/O ports.
Cable shields connected to chassis ground via metal shell
connectors bonded to a conductive module front panel.
Conductive chassis rails connected to chassis ground. This provides
the path for connecting shields to chassis ground.
Front panel screws properly tightened.
All peripherals EMC-compliant.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the FCC compliance of
the equipment containing the module.
The MVME2300SC is a board-level product and meant to be used in
standard VME applications. As such, it is the responsibility of the OEM to
meet the regulatory guidelines as determined by its application.
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