Electrostatic Discharge; Thermal Consideration - Quectel EG91 Series Hardware Design

WCDMA B8
LTE-FDD B1 (10M)
LTE-FDD B3 (10M)
LTE-FDD B7 (10M)
LTE-FDD B8 (10M)
LTE-FDD B20 (10M)
LTE-FDD B28 (10M)
The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module's electrostatic discharge characteristics.
Table 44: Electrostatic Discharge Characteristics
Test Points
VBAT, GND
All Antenna Interfaces
Other Interfaces
In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On customers' PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply, etc.
EG91_Hardware_Design
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6.7. Electrostatic Discharge

Contact Discharge
±5
±4
±0.5

6.8. Thermal Consideration

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EG91 Hardware Design
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Air Discharge
±10
±8
±1
LTE Module Series
-103.7dBm
-96.3dBm
-93.3dBm
-94.3dBm
-93.3dBm
-93.3dBm
-94.8dBm
Unit
KV
KV
KV