Quectel EG91 Series Hardware Design page 82

EG91 Module
Application Board
Figure 40: Referenced Heatsink Design (Heatsink at the Backsideof Customers' PCB)
NOTES
1. The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115°C. Therefore, the
thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105°C. Customers can execute AT+QTEMP command and get the
maximum BB chip temperature from the first returned value.
2. For more detailed guidelines on thermal design, please refer to document [6].
EG91_Hardware_Design
Thermal Pad
Thermal Pad
Heatsink
Shielding Cover
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LTE Module Series
EG91 Hardware Design
Heatsink
Application Board