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Quectel EG915U Series Hardware Design

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EG915U Series
Hardware Design
LTE Standard Module Series
Version: 1.0
Date: 2021-11-23
Status: Released

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Summary of Contents for Quectel EG915U Series

  • Page 1 EG915U Series Hardware Design LTE Standard Module Series Version: 1.0 Date: 2021-11-23 Status: Released...
  • Page 2 LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Len CHEN/Reuben WANG/ 2021-11-23 Creation of the document Frank WANG/Ailsa WANG Len CHEN/Reuben WANG/ 2021-11-23 First official release Frank WANG/Ailsa WANG EG915U_Series_Hardware_Design 4 / 81...

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................10 1.1. Special Mark ..........................10 Product Overview ..........................11 2.1. Frequency Bands and Functions .................... 11 2.2.
  • Page 7 LTE Standard Module Series 4.1.3. Receiver Interface Design ....................39 4.2. USB Interface .......................... 40 4.3. USB_BOOT Interface ......................42 4.4. (U)SIM Interface ........................43 4.5. I2C and PCM Interfaces ....................... 45 4.6. UART Interfaces ........................46 4.7. ADC Interface .......................... 48 4.8.
  • Page 8 LTE Standard Module Series Table Index Table 1: Special Mark ..........................10 Table 2: Wireless Network Type ........................11 Table 3: I/O Parameters Definition ......................16 Table 4: Pin Description ..........................16 Table 5: Overview of Operating Modes ...................... 25 Table 6: Pin Definition of Power Supply ..................... 30 Table 7: Pin Definition of PWRKEY ......................
  • Page 9 LTE Standard Module Series Figure Index Figure 1: Functional Diagram ........................14 Figure 2: EG915U Series Module Pin Assignment (Top View) ..............15 Figure 3: Sleep Mode Application via UART ....................26 Figure 4: Sleep Mode Application with USB Remote Wakeup ..............27 Figure 5: Sleep Mode Application with MAIN_RI ..................
  • Page 10 LTE Standard Module Series Figure 42: Reel Specifications ........................83 Figure 43: Tape and Reel Directions ......................84 EG915U_Series_Hardware_Design 9 / 81...

  • Page 11: Introduction

    LTE Standard Module Series Introduction This document defines the EG915U series module and describes its air interfaces and hardware interfaces which are connected with relate to customers’ applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module.

  • Page 12: Product Overview

    2.4 GHz Scan EG915U series support Bluetooth and Wi-Fi Scan functions. Due to the shared antenna interface, the two functions cannot be used simultaneously. Bluetooth and Wi-Fi Scan functions are optional (both supported or not), please contact Quectel Technical Support for details.

  • Page 13: Key Features

    LTE Standard Module Series 2.2. Key Features The following table describes the detailed features of EG915U series module. Table 4: Key Features of EG915U Series Module Features Description ⚫ Supply voltage: 3.3–4.3 V Power Supply ⚫ Typical supply voltage: 3.8 V EG915U-CN: ⚫...
  • Page 14 ADC Interfaces Supports two ADC Interfaces ⚫ Network Indication NET_STATUS used to indicate the network connectivity status ⚫ Compliant with 3G PP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands ⚫ USB_BOOT Interface Supports one download control interface ⚫...

  • Page 15: Functional Diagram

    LTE Standard Module Series ⚫ Position Fixing Support Wi-Fi Scan ⚫ Operation temperature range: -35 to +75 ° C ⚫ Temperature Range Extended temperature range: -40 to +85 ° C ⚫ Storage temperature range: -40 to +90 ° C ⚫ Firmware Upgrade USB interface and DFOTA ⚫...

  • Page 16: Pin Assignment

    Keep NC and RESERVED pins unconnected, all GND pins shall be connected to the ground. The function of PSM is under development and it is not recommended to use it right now. The module supports dual-SIM single stand by. For details, please contact Quectel Technical Support.

  • Page 17: Pin Description

    LTE Standard Module Series 2.5. Pin Description The following tables show the pin definition of the module. Table 3: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 4: Pin Description Power Supply...
  • Page 18 LTE Standard Module Series If unused, keep it open. Power On/Off Pin Name Pin No. Description DC Characteristics Comment VBAT power PWRKEY Turn on/off the module domain. VBAT power max = 0.5 V domain. RESET_N Reset the module If unused, keep it open.
  • Page 19 LTE Standard Module Series Vmin = 1.7 V can be identified automatically by For 3.0 V (U)SIM: the module. Vmax = 3.05 V Vmin = 2.7 V For 1.8 V (U)SIM: max = 0.6 V min = 1.26 V max = 0.45 V min = 1.35 V USIM1_DATA (U)SIM1 card data...
  • Page 20 LTE Standard Module Series 1.8 V (U)SIM： max = 0.6 V min = 1.26 V max = 0.45 V min = 1.35 V USIM2_DATA (U)SIM2 card data 3.0 V (U)SIM： max = 1.0 V min = 1.95 V max = 0.45 V min = 2.55 V 1.8 V (U)SIM：...
  • Page 21 LTE Standard Module Series Main UART data carrier max = 0.45 V MAIN_DCD detect min = 1.35 V max = 0.45 V MAIN_TXD Main UART transmit min = 1.35 V Main UART ring max = 0.45 V MAIN_RI indication min = 1.35 V min = -0.3 V Main UART data terminal max = 0.6 V...
  • Page 22 LTE Standard Module Series connection of multiple peripherals except for codec PCM Interface Pin Name Pin No. Description DC Characteristics Comment min = -0.3 V max = 0.6 V PCM_SYNC PCM data frame sync min = 1.26 V max = 2.0 V min = -0.3 V 1.8 V power max = 0.6 V...
  • Page 23 LTE Standard Module Series min = -0.3 V max = 0.6 V SPI_DIN SPI master mode input min = 1.26 V max = 2.0 V max = 0.45 V SPI_DOUT SPI master mode output min = 1.35 V ADC Interface Pin Name Pin No.
  • Page 24 LTE Standard Module Series Indicate the module’s PSM_IND power saving mode External interrupt pin; PSM_EINT wake up the module from Other Interfaces Pin Name Pin No. Description DC Characteristics Comment 1.8 V power domain. Pulled up by default. When it is in low voltage level, the module can min = -0.3 V...

  • Page 25: Evb

    2.6. EVB In order to help customers develop applications with EG915U series moduel. Quectel provides an evaluation board (UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antennas and other peripherals to control or test the module.

  • Page 26: Operating Characteristics

    LTE Standard Module Series Operating Characteristics EG915U series module have a total of 126 pins, The subsequent chapters will provide detailed descriptions of the following interfaces. ⚫ Power supply ⚫ (U)SIM interface ⚫ USB interface ⚫ UART interfaces ⚫ SPI interface ⚫...

  • Page 27: Sleep Mode

    Figure 3: Sleep Mode Application via UART ⚫ Driving MAIN_DTR low will wake up the module. ⚫ When EG915U series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. See Chapter 4.10.3 for details about MAIN_RI behavior. EG915U_Series_Hardware_Design 26 / 81...

  • Page 28: Usb Application Scenario

    LTE Standard Module Series 3.2.2. USB Application Scenario If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions can make the module enter the sleep mode. ⚫ Execute AT+QSCLK=1 to enable the sleep mode. ⚫ Ensure the MAIN_DTR is kept at high level or kept open. ⚫...
  • Page 29 LTE Standard Module Series 1. Under Linux OS, USB support Suspend, under Windows OS nonsupport Suspend. 2. Pay attention to the level match shown in dotted line between the module and the host. EG915U_Series_Hardware_Design 28 / 81...

  • Page 30: Usb Application With Usb Suspend/Resume And Main_Ri Wakeup Function

    LTE Standard Module Series 3.2.2.2. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host. The following figure shows the connection between the module and the host. Module Host USB_VBUS...

  • Page 31: Airplane Mode

    LTE Standard Module Series 3.3. Airplane Mode When the module enters into airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. This mode can be set via the following ways. 3.3.1. Hardware The W_DISABLE# pin is pulled up by default.

  • Page 32: Reference Design For Power Supply

    LTE Standard Module Series 91, 100, 101, 102 3.4.2. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of the module should be able to provide sufficient current of 3.0 A at least.

  • Page 33: Turn On

    LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease the voltage drop, use bypass capacitors of about 100 µF with low ESR (ESR = 0.7 Ω) and reserve a multi-layer ceramic chip (MLCC) capacitor array due to their ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to the VBAT_SENSE and VBAT_RF pins.
  • Page 34 LTE Standard Module Series simple reference circuit is illustrated in the following figure. PWRKEY 4.7K 10 nF Turn-on pulse Figure 9: Turing on the Module Using Driving Circuit Another way to control the PWRKEY is using a button directly. When you are pressing the key, electrostatic strike may be generated from finger.

  • Page 35: Turn Off

    LTE Standard Module Series Note 1 ≥ 2 s VBAT ≤ 0.5 V PWRKEY About 1.15 s VDD_EXT RESET_N ≥ 4 s UART I nactive Active ≥ 2.23 s I nactive Active Figure 11: Power-up Timing NOTE 1. Make sure that the VBAT is stable before pulling down PWRKEY pin. It is recommended that the time difference between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms.

  • Page 36: Turn Off With Pwpkey

    LTE Standard Module Series 3.6.1. Turn off with PWPKEY Drive the PWRKEY pin low for at least 3 s and then release PWRKEY. After this, the module executes power-down procedure. The power-down scenario is illustrated in the following figure. VBA T 30 s PWRKEY Module...

  • Page 37: Reset

    LTE Standard Module Series 3.7. Reset The RESET_N pin can be used to reset the module. The module can be reset by pulling the RESET_N pin low for at least 100 ms and then releasing it. The RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground.
  • Page 38 LTE Standard Module Series VBAT ≥ 100 ms RESET_N ≤ 0.5 V Module Running Baseband restart Baseband resetting Status Figure 15: Timing of Resetting the Module ⚫ NOTE Ensure that there is no large capacitance exceeding 10 nF on PWRKEY and RESET_N pins. It is recommended to use RESET_N only when you fail to turn off the module with the AT+QPOWD or PWRKEY pin.

  • Page 39: Application Interfaces

    LTE Standard Module Series Application Interfaces 4.1. Analog Audio Interfaces The module provides one analog audio input channel and one analog audio output channel. The pin definitions are shown in the following table. Table 9: Pin Definition of Analog Audio Interfaces Pin Name Pin No.

  • Page 40: Microphone Interface Design

    LTE Standard Module Series as possible, and the traces should be as short as possible. They should go through the filter capacitors before arriving at other connection points. To reduce radio or other signal interference, RF antennas should be placed away from audio interfaces and audio traces.

  • Page 41: Usb Interface

    Figure 17: Reference Design for Receiver Interface 4.2. USB Interface EG915U series module provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade.
  • Page 42 LTE Standard Module Series Table 11: Pin Definition of USB Interface Pin Name Pin No. Description Comment Typical 5.0 V USB_VBUS USB connection detect Minimum 3.5 V USB 2.0 compliant. USB_DP USB differential data (+) Require differential impedance of 90 Ω. USB_DM USB differential data (-) If unused, keep it open.

  • Page 43: Usb_Boot Interface

    LTE Standard Module Series layer and ground planes above and below. ⚫ Pay attention to the selection of the ESD component on the USB data line. Its stray capacitance should not exceed 2 pF and should be placed as close as possible to the USB connector. 4.3.

  • Page 44: U)Sim Interface

    (U)SIM2 card hot-plug detect keep it open EG915U series module supports (U)SIM card hot-plug via the USIM_DET pin and both high and low level detections are supported. By default, the function is disabled, please see AT+QSIMDET in document [2] for more details.
  • Page 45 LTE Standard Module Series VDD_EXT USIM_VDD 100 nF (U)SIM Card Connector USIM_VDD USIM_RST Module USIM_CLK Switch USIM_DET USIM_DATA 33 pF 33 pF 33 pF Figure 20: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

  • Page 46: I2C And Pcm Interfaces

    LTE Standard Module Series ⚫ To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. ⚫ To offer good ESD protection, it is recommended to add a TVS diode array of which the parasitic capacitance should be less than 15 pF.

  • Page 47: Uart Interfaces

    LTE Standard Module Series NM 0R External 26MHz Crystal MICBIAS CAM_MCLK MCLK PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT PCM_DIN LOUTP I2C_SCL I2C_SDA LOUTN Module Codec 1.8 V Figure 22: Reference Circuit of I2 C and PCM Application with Audio Codec NOTE 1.
  • Page 48 LTE Standard Module Series DTE request to send signal to open. MAIN_RTS DCE (connect to DTE’s RTS) MAIN_RXD Main UART receive MAIN_DCD Main UART data carrier detect MAIN_TXD Main UART transmit MAIN_RI Main UART ring indication MAIN_DTR Main UART data terminal ready Table 15: Pin Definition of Debug UART Interface Pin Name Pin No.

  • Page 49: Adc Interface

    LTE Standard Module Series Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as follows. For the design of circuits in dotted lines, please refer to that of the circuits in solid lines, but please pay attention to the direction of connection.
  • Page 50 LTE Standard Module Series Table 17: Pin Definition of ADC Interface Pin Name Pin No. Description Comment A 1 kΩ series resistor ADC0 General-purpose ADC is required for use. interface If unused, keep it ADC1 open. Table 21: Characteristics of ADC Interface Name Min.

  • Page 51: Spi Interface

    LTE Standard Module Series 4.8. SPI Interface The module provides one SPI interface that only supports master mode. It has a working voltage of 1.8 V and a maximum clock frequency of 25 MHz. Table 22: Pin Definition of SPI Interface Pin Name Pin No.

  • Page 52: Indication Signal

    LTE Standard Module Series Table 18: Pin Definition of PSM Interface Pin Name Pin No. Description Comment Indicate the module’s power VRTC power PSM_IND saving mode domain External interrupt pin; Wake up VRTC power PSM_EINT the module from PSM. domain A reference circuit is shown in the following figure.

  • Page 53: Network Status Indication

    LTE Standard Module Series 4.10.1. Network Status Indication The network indication pins NET_STATUS can drive the network status indicators. The following tables describe pin definition and logic level changes in different network status. Table 20: Working State of Network Connection Status/Activity Indication Pin Name Status Network Status...

  • Page 54: Main_Ri

    LTE Standard Module Series Table 21: Pin Definition of STATUS Pin Name Pin No. Description Comment A reference circuit is shown as below. VBAT Module 2.2K 4.7K STATUS Figure 27: Reference Circuits of STATUS NOTE 4.10.3. MAIN_RI AT+QCFG= “risignaltype”, “physical” command can be used to configure MAIN_RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI.

  • Page 55: Control Signal

    LTE Standard Module Series Table 22: Behaviors of the MAIN_RI State Response Idle MAIN_RI keeps at high level. MAIN_RI outputs 120 ms low pulse when a new URC return. The MAIN_RI behavior can be changed via AT+QCFG="urc/ri/ring"*. Please refer to document [2] for details.

  • Page 56: Antenna Interfaces

    LTE Standard Module Series Antenna Interfaces EG915U series module provides a main antenna interface, a Bluetooth/Wi-Fi Scan antenna interface. The impedance of antenna ports is 50 Ω. 5.1. Main Antenna Interface 5.1.1. Pin Definition Table 24: Pin Definition of RF Antennas Pin Name Pin No.
  • Page 57 LTE Standard Module Series EGSM900 880-915 925-960 DCS1800 1710-1785 1805-1880 LTE-B1 1920-1980 2110-2170 LTE-B3 1710-1785 1805-1880 LTE-B5 824-849 869-894 LTE-B8 880-915 925-960 LTE-B34 2010-2025 2010-2025 LTE-B38 2570-2620 2570-2620 LTE-B39 1880-1920 1880-1920 LTE-B40 2300-2400 2300-2400 LTE-B41 2535-2675 2535-2675 Table 26: Operating Frequency of EG915U-EU Operating Frequency Transmit (MHz) Receive (MHz)

  • Page 58: Reference Design Of Antenna Interface

    LTE Standard Module Series Table 27: Operating Frequency of EG915U-LA Operating Frequency Transmit (MHz) Receive (MHz) GSM850 824-849 869-894 PCS1900 1850-1910 1930-1990 EGSM900 880-915 925-960 DCS1800 1710-1785 1805-1880 LTE-B2 1850-1910 1930-1990 LTE-B3 1710-1785 1805-1880 LTE-B4 1710-1755 2110-2155 LTE-B5 824-849 869-894 LTE-B7 2500-2570 2620-2690...

  • Page 59: Operating Frequency

    LTE Standard Module Series Main Module antenna R1 0R ANT_MAIN Wi-Fi Scan/ R2 0R antenna ANT_BT/ WIFI_SCAN Figure 28: Reference Circuit of RF Antenna 5.1.4. Operating Frequency For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’...
  • Page 60 LTE Standard Module Series Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: EG915U_Series_Hardware_Design 59 / 91...

  • Page 61: Antenna Installation

    LTE Standard Module Series ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. ⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
  • Page 62 LTE Standard Module Series Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. EG915U_Series_Hardware_Design 61 / 91...
  • Page 63 LTE Standard Module Series Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com. EG915U_Series_Hardware_Design 62 / 91...

  • Page 64: Electrical Characteristics & Reliability

    LTE Standard Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 32: Absolute Maximum Ratings Parameter Min.

  • Page 65: Operation And Storage Temperatures

    LTE Standard Module Series Voltage drop during peak data rate Peak supply current Maximum power control (during transmission VBAT level at EGSM 900 slot) USB connection USB_VBUS 5.25 detection 6.3. Operation and Storage Temperatures Table 30: Operating and Storage Temperatures Parameter Min.
  • Page 66 LTE Standard Module Series AT+CFUN=4 (USB connected) EGSM @ DRX = 2 (USB disconnected) EGSM @ DRX = 5 (USB disconnected) EGSM @ DRX = 5 (USB connected) EGSM @ DRX = 9 (USB disconnected) DCS @ DRX = 2 (USB disconnected) DCS @ DRX = 5 (USB disconnected) DCS @ DRX = 5 (USB connected) DCS @ DRX = 9 (USB disconnected)
  • Page 67 LTE Standard Module Series LTE-FDD B3 @ 22.86 dBm LTE-FDD B5 @ 23.51 dBm LTE-FDD B8 @ 22.79 dBm LTE-FDD B34 @ 23.32 dBm LTE-FDD B38 @ 23.29 dBm LTE-FDD B39 @ 23.15 dBm LTE-FDD B40 @ 22.97 dBm LTE-FDD B41 @ 23.06 dBm GSM900 4DL/1UL @ 32.86 dBm GSM900 3DL/2UL @ 30.86 dBm GSM900 2DL/3UL @ 28.81 dBm...
  • Page 68 LTE Standard Module Series DCS1800P CL=7 @ 15.97 dBm DCS1800P CL=15 @ 0.28 dBm 0.15 Table 32: EG915U-EU Current Consumption EG915U-EU Description Conditions Typ. Unit OFF state Power down µA AT+CFUN=0 (USB disconnected) 1.01 AT+CFUN=0 (USB connected) AT+CFUN=4 (USB disconnected) 1.02 AT+CFUN=4 (USB connected) 2.21...
  • Page 69 LTE Standard Module Series EGSM @ DRX = 5 (USB connected) 27.3 LTE-FDD @ PF = 64 (USB disconnected) 12.38 LTE-FDD @ PF = 64 (USB connected) 27.58 LTE-FDD B1 @ 22.29 dBm LTE-FDD B3 @ 22.88 dBm LTE-FDD B5 @ 23.01 dBm LTE data transfer LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.17 dBm...
  • Page 70 LTE Standard Module Series PCS1900 1DL/4UL @ 23.59 dBm GSM850 PCL=5 @ 32.82 dBm GSM850 PCL=12 @ 19.08 dBm GSM850 PCL=19 @ 6.12 dBm GSM900 PCL=5 @ 32.34 dBm GSM900 PCL=12 @ 19.06 dBm GSM900 PCL=19 @ 5.39 dBm GSM voice call DCS1800P CL=0 @ 29.89 dBm DCS1800P CL=7 @ 15.96 dBm DCS1800P CL=15 @ 0.95 dBm...
  • Page 71 LTE Standard Module Series Table 33: EG915U-LA Current Consumption EG915U-LA Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 0.98 AT+CFUN=0 (USB connected) 2.38 AT+CFUN=4 (USB disconnected) 1.06 AT+CFUN=4 (USB connected) 2.43 EGSM @ DRX = 2 (USB disconnected) 2.20 EGSM @ DRX = 5 (USB disconnected) 1.65...
  • Page 72 LTE Standard Module Series LTE-FDD B3 @ 22.88 dBm LTE-FDD B4 @ 22.94d Bm LTE-FDD B5 @ 23.01 dBm LTE-FDD B7 @ 22.95 dBm LTE-FDD B8 @ 23.17 dBm LTE-FDD B28 @ 23.06 dBm LTE-FDD B66 @ 22.81d Bm GSM850 4DL/1UL @ 32.96 dBm GSM850 3DL/2UL @ 30.7 dBm GSM850 2DL/3UL @ 28.66 dBm GSM850 1DL/4UL @ 26.41 dBm...

  • Page 73: Tx Power

    LTE Standard Module Series GSM900 PCL=5 @ 32.34 dBm GSM900 PCL=12 @ 19.06 dBm GSM900 PCL=19 @ 5.39 dBm DCS1800P CL=0 @ 29.89 dBm DCS1800P CL=7 @ 15.96 dBm DCS1800P CL=15 @ 0.95 dBm PCS1900P CL=0 @ 29.66 dBm PCS1900P CL=7 @ 15.59 dBm PCS1900P CL=15 @ 0.58 dBm 6.5.

  • Page 74: Rx Sensitivity

    LTE Standard Module Series Table 36: EG915U-LA RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power GSM850/EGSM900 33 dBm ± 2 dB 5 dBm ± 5 dB DCS1800/PCS1900 30 dBm ± 2 dB 0 dBm ± 5 dB LTE-FDD B2/B3/B4/B5/B7/B8/B28/B66 23 dBm ±...
  • Page 75 LTE Standard Module Series Table 38: EG915U-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) 3GPP (SIMO) Frequency Primary+ Diversity Primary GSM850 -108 -102 dBm EGSM900 -106.5 -102 dBm DCS1800 -107.5 -102 dBm PCS1900 -107 -102 dBm LTE-FDD B1 (10 MHz) -96.3 dBm LTE-FDD B3 (10 MHz) -98.3...

  • Page 76: Esd

    LTE Standard Module Series LTE-FDD B5 (10 MHz) -97.4 -94.3 dBm LTE-FDD B7 (10 MHz) -96.1 -94.3 dBm LTE-FDD B8 (10 MHz) -97.5 -93.3 dBm LTE-TDD B28 (10 MHz) -99.4 -93.3 dBm LTE-TDD B66 (10 MHz) -97.9 -95.8 dBm 6.7. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent.

  • Page 77: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.2 Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm) EG915U_Series_Hardware_Design 76 / 91...
  • Page 78 LTE Standard Module Series Figure 37: Module Bottom Dimensions ⚫ NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG915U_Series_Hardware_Design 77 / 91...

  • Page 79: Recommended Footprint

    LTE Standard Module Series 7.3 Recommended Footprint Figure 38: Recommended Footprint (TOP View) NOTE 1. For easy maintenance of the module, keep about 3 mm between the module and other components on the motherboard. 2. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least 1.2 mm EG915U_Series_Hardware_Design 78 / 91...

  • Page 80: Top And Bottom Views

    Figure 39: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EG915U_Series_Hardware_Design 79 / 91...

  • Page 81: Storage, Manufacturing & Packaging

    LTE Standard Module Series Storage, Manufacturing & Packaging 8.1 Storage Conditions Module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity should be 35–60%.

  • Page 82: Manufacturing And Soldering

    LTE Standard Module Series NOTE To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.

  • Page 83: Packaging Specifications

    Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4].
  • Page 84 LTE Standard Module Series The figures below show the package details, measured in mm. Figure 41: Tape Specifications Table 39:Tape Size（mm） 0.35 20.2 3.15 6.65 20.2 1.75 Figure 42: Reel Specifications EG915U_Series_Hardware_Design 83 / 91...

  • Page 85: Packaging Process

    LTE Standard Module Series Figure 43: Tape and Reel Directions Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.
  • Page 86 LTE Standard Module Series Put 4 packaged pizza boxes into 1 cartoon box and seal it. 1 cartoon box can pack 1000 modules. Figure 43: Packaging Process EG915U_Series_Hardware_Design 85 / 91...

  • Page 87: Appendix References

    LTE Standard Module Series Appendix References Table 42: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_EG915U-EU_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_SMT_User_Guide Table 43: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter AMR-WB Adaptive Multi-Rate Wideband Active Optical Network Application Processor Bits Per Second BPSK Binary Phase Shift Keying Bandwidth...
  • Page 88 LTE Standard Module Series Clear To Send Digital Audio Interface Data Communications Equipment DC-HSDPA Dual-carrier High Speed Downlink Packet Access Double Data Rate DFOTA Delta Firmware Upgrade Over The Air Downlink Discontinuous Reception Diversity Receive Data Terminal Equipment Data Terminal Ready Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex...
  • Page 89 LTE Standard Module Series HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access Integrated Circuit Inter-Integrated Circuit Inter-IC Sound Input/Output Inorm Normal Current License Assisted Access Low Band Light Emitting Diode Land Grid Array LMHB Low/Middle/High Band Low Noise Amplifier Long Term Evolution Media Access Control Middle Band...
  • Page 90 LTE Standard Module Series Non-Stand Alone Power Amplifier Password Authentication Protocol Personal Computer Printed Circuit Board PCIe Peripheral Component Interconnect Express Pulse Code Modulation Personal Digital Assistant Protocol Data Unit Physical Layer PMIC Power Management Integrated Circuit Primary Receive Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying QZSS...
  • Page 91 LTE Standard Module Series Short Message Service System on a Chip Serial Peripheral Interface Set Top Box Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA Time Division-Synchronous Code Division Multiple Access Transmit & Receive Transmit UART Universal Asynchronous Receiver/Transmitter Ultra High Band Uplink UMTS...
  • Page 92 LTE Standard Module Series Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network WWAN...

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