Packaging - Quectel EG91 Series Hardware Design

Max slope
Reflow time (D: over 220°C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
EG91is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until
the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the
packaging details, measured in mm.
EG91_Hardware_Design

8.3. Packaging

Figure 47: Tape Dimensions
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EG91 Hardware Design
2 to 3°C/sec
40 to 60 sec
240°C ~ 245°C
1 to 4°C/sec
1
LTE Module Series