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Quectel EG91 Series Hardware Design

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EG
G91
Ha
rdw
war
re D D es s ign
n
LTEM
Module S
Series
Rev.
EG91_Ha
ardware_
_Design_
_V1.3
Date:
2019-02
2-03
Statu
s: Releas
sed
www.quec
ctel.com

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Summary of Contents for Quectel EG91 Series

  • Page 1 re D D es s ign LTEM Module S Series Rev. EG91_Ha ardware_ _Design_ _V1.3 Date: 2019-02 2-03 Statu s: Releas www.quec ctel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Module Series EG91 Hardware Design About the Document History Revision Date Author Description Felix YIN/ 2017-03-22 Yeoman CHEN/ Initial Jackie WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4.
  • Page 4 LTE Module Series EG91 Hardware Design Updated pin definition of RF antenna in Table 21. Updated module operating frequencies in Table 22. 10. Added description GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1.

  • Page 5: Table Of Contents

    LTE Module Series EG91 Hardware Design Contents About the Document ..........................2  Contents ..............................4  Table Index ............................... 7  Figure Index .............................. 9  1  Introduction ............................. 11  1.1.  Safety Information ......................... 12  1.2.  FCC/ISED Regulatory notices ....................13  2  Product Concept ..........................16 ...
  • Page 6 LTE Module Series EG91 Hardware Design 3.12.  PCM and I2C Interfaces ......................48  3.13.  SPI Interface ......................... 51  3.14.  Network Status Indication ..................... 51  3.15.  STATUS ..........................52  3.16.  ADC Interface ........................53  3.17.  Behaviors of RI ........................54  3.18.  USB_BOOT Interface......................
  • Page 7 LTE Module Series EG91 Hardware Design 11  Appendix C GPRS Multi-slot Classes .................... 95  12  Appendix D EDGE Modulation and Coding Schemes ..............97  EG91_Hardware_Design 6 / 93...
  • Page 8 LTE Module Series EG91 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ............... 16   TABLE 2: KEY FEATURES OF EG91 MODULE ....................17   TABLE 3: IO PARAMETERS DEFINITION ......................23   TABLE 4: PIN DESCRIPTION ........................... 23  ...
  • Page 9 LTE Module Series EG91 Hardware Design TABLE 43: EG91-EC CONDUCTED RF RECEIVING SENSITIVITY ............... 78   TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ..............79   TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............... 87   TABLE 46: RELATED DOCUMENTS ........................ 90   TABLE 47: TERMS AND ABBREVIATIONS ......................
  • Page 10 LTE Module Series EG91 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 20   FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ....................22   FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................31   FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............ 32  ...
  • Page 11 LTE Module Series EG91 Hardware Design FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....80   FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB) ................................... 81   FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................82  ...

  • Page 12: Introduction

    LTE Module Series EG91 Hardware Design Introduction This document defines the EG91module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical andmechanical details, as well as other related information of EG91 module. Associated with application note and user guide, customers can use EG91 module to design and set up mobile applications easily.

  • Page 13: Safety Information

    EG91module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 14: Fcc/Ised Regulatory Notices

    1.2. FCC/ISED Regulatory notices Modification statement Quectel has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Quectel n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
  • Page 15 LTE Module Series EG91 Hardware Design WCDAM II:≤9.00dBi ❒ WCDAM V:≤6.00dBi ❒ WCDAM VIII:≤7.15dBi ❒ ❒ LTE Band2:≤8.50dBi ❒ LTE Band4:≤5.50dBi ❒ LTE Band5:≤6.64dBi ❒ LTE Band12:≤6.15dBi ❒ LTE Band13:≤6.44dBi ❒ L TE Band25:≤8.50dBi ❒ L TE Band25:≤6.63dBi L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
  • Page 16 LTE Module Series EG91 Hardware Design CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. Installation Guidance The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

  • Page 17: Product Concept

    LTE Module Series EG91 Hardware Design Product Concept 2.1. General Description EG91module is an embedded 4G wireless communication module with receive diversity. It supportsLTE-FDD/WCDMA/GSM wireless communication, andprovides data connectivity LTE-FDD,DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It can also provide voice functionality to meet customers’...

  • Page 18: Key Features

    LTE Module Series EG91 Hardware Design With a compact profile of 29.0mm ×25.0mm ×2.3mm, EG91 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.
  • Page 19 LTE Module Series EG91 Hardware Design Support EDGE multi-slot class 33(33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/ SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols...

  • Page 20: Functional Diagram

    LTE Module Series EG91 Hardware Design Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Network Indication NETLIGHTpin for network activitystatusindication Including main antenna interface (ANT_MAIN), Rx-diversity antenna Antenna Interfaces (ANT_DIV) interface and GNSS antenna interface(ANT_GNSS) Size: (29.0±0.15)mm ×...

  • Page 21: Evaluation Board

    GNSS antenna interface is only supported on EG91-NA/-NS/-V/-EC. 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing ofEG91 module. The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), USB data cable, earphone, antenna and other peripherals.

  • Page 22: Application Interfaces

    LTE Module Series EG91 Hardware Design Application Interfaces 3.1. General Description EG91is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters: ...

  • Page 23: Pin Assignment

    LTE Module Series EG91 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG91 module. ANT_GNSS (EG91-NA/-NS/-V/-EC) ANT_DIV (EG91-E) USIM_GND PCM_CLK USIM1_CLK PCM_SYNC USIM1_DATA USIM2_PRESENCE PCM_DIN USIM1_RST PCM_DOUT USIM1_VDD USIM2_CLK USIM1_PRESENCE USB_VBUS USB_DP USIM2_RST I2C_SDA I2C_SCL USB_DM USIM2_DATA USB_BOOT...

  • Page 24: Pin Description

    LTE Module Series EG91 Hardware Design NOTES PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Keep all RESERVEDpins and unused pins unconnected. GND pads should be connected to ground in the design. Definition of pin 49 and 56 are different amongEG91-E/-NS/-V/-EC and EG91-NA.For more details, please refer to Table 4.
  • Page 25 LTE Module Series EG91 Hardware Design It must be able to Vmax=4.3V Power supply for provide sufficient VBAT_RF 52, 53 Vmin=3.3V module’s RF part current up to 1.8A in a Vnorm=3.8V burst transmission. Power supply for Provide 1.8V for Vnorm=1.8V external GPIO’s pull up VDD_EXT external circuit...
  • Page 26 LTE Module Series EG91 Hardware Design Compliant with USB USB differential Require differential USB_DP 2.0 standard data bus (+) impedance of 90Ω. specification. Compliant with USB USB differential Require differential USB_DM 2.0 standard data bus (-) impedance of 90Ω. specification. (U)SIM Interfaces Pin Name Pin No.
  • Page 27 LTE Module Series EG91 Hardware Design For 1.8V (U)SIM: max=0.45V min=1.35V Reset signal of USIM1_RST (U)SIMcard For 3.0V (U)SIM: max=0.45V min=2.55V min=-0.3V 1.8V power domain. USIM1_ (U)SIMcard max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open. max=2.0V For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V Either 1.8V or 3.0V is...
  • Page 28 LTE Module Series EG91 Hardware Design min=2.55V min=-0.3V 1.8V power domain. USIM2_ (U)SIMcard max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open. max=2.0V Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it min=1.35V open.
  • Page 29 LTE Module Series EG91 Hardware Design open. min=-0.3V 1.8V power domain. max=0.6V DBG_RXD Receive data If unused, keep it min=1.2V open. max=2.0V PCM Interface Pin Name Pin No. Description DC Characteristics Comment min=-0.3V 1.8V power domain. max=0.6V PCM_DIN PCM data input If unused, keep it min=1.2V open.
  • Page 30 LTE Module Series EG91 Hardware Design ADC Interface Pin Name Pin No. Description DC Characteristics Comment General purpose Voltage range: If unused, keep it ADC0 analog to digital 0.3V to VBAT_BB open. converter SPI Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain.

  • Page 31: Operating Modes

    LTE Module Series EG91 Hardware Design min=-0.3V Application 1.8V power domain. max=0.6V AP_READY processor sleep If unused, keep it min=1.2V state detection open. max=2.0V Force the module to min=-0.3V 1.8V power domain. enter into max=0.6V It is recommended to USB_BOOT emergency min=1.2V reserve the test...

  • Page 32: Power Saving

    LTE Module Series EG91 Hardware Design Mode Airplane AT+CFUN command or W_DISABLE# pin can set the module to enter intoairplane Mode mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally.

  • Page 33: Usb Application With Usb Remote Wakeup Function

    LTE Module Series EG91 Hardware Design  When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17for details about RI behavior.  AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"*commandfor details.

  • Page 34: Usb Application Without Usb Suspend Function

    LTE Module Series EG91 Hardware Design  Execute AT+QSCLK=1commandto enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state.

  • Page 35: Airplane Mode

    LTE Module Series EG91 Hardware Design Figure 6: Sleep Mode Application without Suspend Function Switching onthe power switch tosupply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host.Please refer to document [1] for more details about EG91 power management application.

  • Page 36: Decrease Voltage Drop

    LTE Module Series EG91 Hardware Design The following table shows the details of VBAT pins and ground pins. Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit Power supply for module’s VBAT_RF 52,53 RF part.

  • Page 37: Reference Design For Power Supply

    LTE Module Series EG91 Hardware Design diode with low reverse stand-off voltage V , low clamping voltage V and high reverse peak pulse current I should be used. The following figure shows the star structure of the power supply. VBAT VBAT_RF VBAT_BB 100nF...

  • Page 38: Monitor The Power Supply

    LTE Module Series EG91 Hardware Design 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definitionof PWRKEY.
  • Page 39 LTE Module Series EG91 Hardware Design Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE VBAT ≥500ms =0.8V PWRKEY ≤0.5V About 100ms VDD_EXT ≥100ms, after this time, the BOOT_CONFIG & U SB _BOOT pi n s can b e se t hi gh l eve l by external circuit.

  • Page 40: Turn Off Module

    LTE Module Series EG91 Hardware Design NOTES Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed.

  • Page 41: Reset The Module

    LTE Module Series EG91 Hardware Design NOTES In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off.

  • Page 42: U)Sim Interfaces

    LTE Module Series EG91 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated inthe following figure. Figure 16: Reset Scenario NOTES Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.
  • Page 43 LTE Module Series EG91 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. Description Comment Either 1.8V or 3.0V is USIM1_VDD Power supply for (U)SIM1 card supported by the module automatically. USIM1_DATA Data signal of (U)SIM1 card USIM1_CLK Clock signal of (U)SIM1card USIM1_RST...
  • Page 44 LTE Module Series EG91 Hardware Design Figure 17: Reference Circuitof (U)SIMInterface with an 8-Pin (U)SIMCard Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference circuit of (U)SIM interface with a 6-pin (U)SIMcard connector is illustrated inthe following figure.

  • Page 45: Usb Interface

    LTE Module Series EG91 Hardware Design  Assure the ground trace between the module and the (U)SIMcard connector short and wide. Keep the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible.If the ground is complete on customers’...
  • Page 46 LTE Module Series EG91 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The following figure shows areference circuit of USB interface. Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’sMCU in order to suppress EMI spurious transmission.

  • Page 47: Uart Interfaces

    LTE Module Series EG91 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and thedebug UART interface. The following shows their features.  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps. It supports RTS and CTS hardware flow control, and is used for AT command communication only.
  • Page 48 LTE Module Series EG91 Hardware Design Table 13:Logic Levels of Digital I/O Parameter Min. Max. Unit -0.3 0.45 1.35 The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended.

  • Page 49: Pcm And I2C Interfaces

    LTE Module Series EG91 Hardware Design Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG91 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ...
  • Page 50 LTE Module Series EG91 Hardware Design 125us PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 22: Primary Mode Timing Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. EG91_Hardware_Design 49 / 93...
  • Page 51 LTE Module Series EG91 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. Description Comment PCM_DIN PCM data input 1.8V power domain PCM_DOUT PCM data output 1.8V power domain PCM data frame PCM_SYNC 1.8V power domain synchronization signal PCM_CLK PCM data bit clock...

  • Page 52: Spi Interface

    LTE Module Series EG91 Hardware Design 3.13. SPI Interface SPI interface of EG91acts asthe master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It isdedicated to one-to-one connection, withoutchip select.Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface.

  • Page 53: Status

    LTE Module Series EG91 Hardware Design The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network StatusIndicator Pin Name Pin No. Description Comment NETLIGHT Indicate the module’snetwork activity status 1.8V power domain Table 17: Working State of Network Status Indicator Pin Name...

  • Page 54: Adc Interface

    LTE Module Series EG91 Hardware Design Table 18: Pin Definition of STATUS Pin Name Pin No. Description Comment 1.8V power domain. STATUS Indicate the module’soperatingstatus If unused, keep it open. The following figure showsthe reference circuit of STATUS. Figure 27: Reference Circuit of STATUS 3.16.

  • Page 55: Behaviors Of Ri

    LTE Module Series EG91 Hardware Design Table 20: Characteristics of ADC Interface Parameter Min. Typ. Max. Unit ADC0 Voltage Range VBAT_BB ADC Resolution bits NOTES It is prohibited to supply any voltage to ADC pins when VBAT is removed. It is recommended to use resistor divider circuit for ADC application. 3.17.

  • Page 56: Usb_Boot Interface

    LTE Module Series EG91 Hardware Design 3.18. USB_BOOT Interface EG91provides a USB_BOOT pin. Customerscan pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface. Table 22: Pin Definition of USB_BOOT Interface Pin Name Pin No.
  • Page 57 LTE Module Series EG91 Hardware Design NOTE VBAT ≥500ms V H =0.8V PWRKEY V IL ≤0.5V About 100ms VDD_EXT Setting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode. USB_BOOT RESET_N Figure 29: Timing Sequence for Entering into Emergency Download Mode...

  • Page 58: Gnss Receiver

    LTE Module Series EG91 Hardware Design GNSS Receiver 4.1. General Description EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default.

  • Page 59: Layout Guidelines

    LTE Module Series EG91 Hardware Design Autonomous Hot start @open sky XTRA enabled Accuracy Autonomous CEP-50 <2.5 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.

  • Page 60: Antenna Interfaces

    LTE Module Series EG91 Hardware Design Antenna Interfaces EG91 antenna interfaces include a main antenna interface and anRx-diversity antennainterface which is used toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-V/-EC. The impedance of the antenna port is50Ω.

  • Page 61: Reference Design Of Rf Antenna Interface

    LTE Module Series EG91 Hardware Design WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 WCDMA B8 880~915 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE FDD B4 1710~1755 2110~2155 LTE FDD B5 824~849 869~894 LTE-FDD B7 2500~2570...

  • Page 62: Reference Design Of Rf Layout

    LTE Module Series EG91 Hardware Design Figure 30: Reference Circuit of RF Antenna Interface NOTES Keep a proper distance between the main antenna and theRx-diversityantenna to improve the receiving sensitivity. ANT_DIV function is enabledby default.AT+QCFG="diversity",0command can be used to disable receive diversity.
  • Page 63 LTE Module Series EG91 Hardware Design Figure 31: Microstrip Line Design on a 2-layer PCB Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EG91_Hardware_Design 62 / 93...

  • Page 64: Gnss Antenna Interface

    LTE Module Series EG91 Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design:  Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50Ω.  The GND pins adjacent to RF pins should not bedesigned as thermal relief pads, and should be fully connected to ground.

  • Page 65: Antenna Installation

    LTE Module Series EG91 Hardware Design Figure 35: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3.

  • Page 66: Recommended Rf Connector For Antenna Installation

    LTE Module Series EG91 Hardware Design (EGSM900,WCDMA B5/B8, LTE B5/B8/B12/B13/B20/B26/B28) Cable Insertion Loss: <1.5dB (DCS1800, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25) Cable insertion loss: <2dB (LTE B7) NOTE It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance.
  • Page 67 LTE Module Series EG91 Hardware Design Figure 37:Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38:Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG91_Hardware_Design 66 / 93...

  • Page 68: Electrical, Reliability And Radiocharacteristics

    LTE Module Series EG91 Hardware Design Electrical, Reliability and RadioCharacteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min.

  • Page 69: Operation And Storage Temperatures

    LTE Module Series EG91 Hardware Design Voltage drop during Maximum power control burst transmission level on EGSM900 Peak supply current Maximum power control (during VBAT level on EGSM900 transmissionslot) USB_VBUS 5.25 connectiondetection 6.3. Operation and Storage Temperatures The operation and storage temperaturesare listed in the following table. Table 31: Operation and Storage Temperatures Parameter Min.

  • Page 70: Current Consumption

    LTE Module Series EG91 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state...
  • Page 71 LTE Module Series EG91 Hardware Design EGSM900 1DL/4UL @29.26dBm DCS1800 4DL/1UL @29.2dBm DCS1800 3DL/2UL @29.13dBm DCS1800 2DL/3UL @29.01dBm DCS1800 1DL/4UL @28.86dBm EGSM900 4DL/1UL PCL=8 @27.1dBm EGSM900 3DL/2UL PCL=8 @27.16dBm EGSM900 2DL/3UL PCL=8 @26.91dBm EGSM900 1DL/4UL PCL=8 @26.12dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @25.54dBm DCS1800 3DL/2UL PCL=2 @25.68dBm DCS1800 2DL/3UL PCL=2 @25.61dBm...
  • Page 72 LTE Module Series EG91 Hardware Design WCDMA B1 CH10700 @23.06dBm WCDMA voice call WCDMA B8 CH3012 @23.45dBm Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected)
  • Page 73 LTE Module Series EG91 Hardware Design LTE-FDD B5 CH2525@23.39dBm LTE-FDD B12 CH5060@23.16 dBm LTE-FDD B13 CH5230 @23.36 dBm WCDMA B2 CH9938 @23.34 dBm WCDMA WCDMA B4 CH1537@23.47 dBm voice call WCDMA B5 CH4357@23.37 dBm Table 34: EG91-NS Current Consumption Parameter Description Conditions Typ.
  • Page 74 LTE Module Series EG91 Hardware Design WCDMA B5 HSDPA CH4407@23.05 dBm WCDMA B5 HSUPACH4407 @22.91 dBm LTE-FDD B2 CH1100@23.26 dBm LTE-FDD B4 CH2175@23.52 dBm LTE-FDD B5 CH2525@23.51dBm LTE-FDD B12 CH5060@23.39 dBm datatransfer LTE-FDD B13 CH5230 @23.54 dBm LTE-FDD B25CH8590@23.64 dBm LTE-FDD B26CH8765@23.34 dBm WCDMA B2 CH9938 @23.39 dBm WCDMA...
  • Page 75 LTE Module Series EG91 Hardware Design Table 36 : EG91-EC Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=64 (USB suspended) WCDMA PF=512 (USB disconnected)
  • Page 76 LTE Module Series EG91 Hardware Design DCS1800 2DL/3UL @TBDdBm DCS1800 1DL/4UL @TBDdBm EGSM900 4DL/1UL PCL=8 @TBDdBm EGSM900 3DL/2UL PCL=8 @TBDdBm EGSM900 2DL/3UL PCL=8 @TBDdBm EGSM900 1DL/4UL PCL=8 @TBDdBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @TBDdBm DCS1800 3DL/2UL PCL=2 @TBDdBm DCS1800 2DL/3UL PCL=2 @TBDdBm DCS1800 1DL/4UL PCL=2 @TBDdBm WCDMA B1 HSDPA@TBD dBm WCDMA B1 HSUPA @TBD dBm...

  • Page 77: Rf Output Power

    LTE Module Series EG91 Hardware Design Table 37: GNSS Current Consumption of EG91 Parameter Description Conditions Typ. Unit Cold start @Passive Antenna Searching Hot Start @Passive Antenna (AT+CFUN=0) VBAT (GNSS) Lost state @Passive Antenna Tracking Open Sky @Passive Antenna (AT+CFUN=0) 6.5.

  • Page 78: Rf Receiving Sensitivity

    LTE Module Series EG91 Hardware Design 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 module. Table 39: EG91-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900 -108.6dBm -102dBm DCS1800 -109.4 dBm -102dbm WCDMA B1 -109.5dBm...
  • Page 79 LTE Module Series EG91 Hardware Design LTE-FDD B13 (10M) -99.2dBm -100dBm -102.5dBm -93.3dBm Table 41: EG91-NS Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -110dBm -111dBm -112.5dBm -104.7dBm WCDMA B4 -110dBm -111dBm -112.5dBm -106.7dBm WCDMA B5 -111dBm -111.5dBm -113dBm -104.7dBm...

  • Page 80: Electrostatic Discharge

    LTE Module Series EG91 Hardware Design WCDMA B8 -103.7dBm LTE-FDD B1 (10M) -96.3dBm LTE-FDD B3 (10M) -93.3dBm LTE-FDD B7 (10M) -94.3dBm LTE-FDD B8 (10M) -93.3dBm LTE-FDD B20 (10M) -93.3dBm LTE-FDD B28 (10M) -94.8dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
  • Page 81 LTE Module Series EG91 Hardware Design  Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.
  • Page 82 LTE Module Series EG91 Hardware Design Thermal Pad Thermal Pad EG91 Module Heatsink Heatsink Application Board Shielding Cover Application Board Figure 40: Referenced Heatsink Design (Heatsink at the Backsideof Customers’ PCB) NOTES The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).

  • Page 83: Mechanical Dimensions

    LTE Module Series EG91 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ±0.05mm. 7.1. Mechanical Dimensions of the Module 25±0.15 2.30±0.2 Figure 41: Module Top and Side Dimensions EG91_Hardware_Design 82 / 93...
  • Page 84 LTE Mod dule Series G91 Hardw ware Design Figure 4 42: Module B Bottom Dim mensions (T TopView) EG91_Hard dware_Desi ign 83 / 93...

  • Page 85: Recommended Footprint

    LTE Mod dule Series G91 Hardw ware Design 7.2. Recomm mended Footprin Figure 43: Recom mended Fo ootprint (To op View) NOTE For easyma aintenance o of the modul e, please ke eep about 3m mm between n the module e and other components thehost P...

  • Page 86: Design Effect Drawings Of The Module

    View of the Mod NOTE These are design effe ect drawings s of EG91 m module. Fo r more acc curate pictur res, please refer to the module that t you get fro m Quectel. EG91_Hard dware_Desi 85 / 93...

  • Page 87: Storage, Manufacturing And Packaging

    LTE Module Series EG91 Hardware Design Storage, Manufacturing and Packaging 8.1. Storage EG91is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: ...

  • Page 88: Manufacturing And Soldering

    LTE Module Series EG91 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properlyso as to produce a clean stencil surface on a single pass.

  • Page 89: Packaging

    LTE Module Series EG91 Hardware Design Max slope 2 to 3°C/sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature 240°C ~ 245°C Cooling down slope 1 to 4°C/sec Reflow Cycle Max reflow cycle 8.3. Packaging EG91is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application.
  • Page 90 LTE Module Series EG91 Hardware Design 48.5 C o v e r t a p e D i r e c t i o n o f f e e d +0.20 44.5 -0.00 Figure 48: Reel Dimensions 1083 Carrier tape Carrier tape packing module unfolding...

  • Page 91: Appendix A References

    LTE Module Series EG91 Hardware Design Appendix A References Table 46: Related Documents Document Name Remark Power Management Application Note Quectel_EC2x&EG9x&EM05_Power_Management_A for EC25, EC21, EC20 R2.0, EC20 pplication_Note R2.1, EG95, EG91 and EM05 AT Commands Manual for EG95 and Quectel_EG9x_AT_Commands_Manual EG91 Quectel_EC25&EC21_GNSS_AT_Commands_ GNSS AT Commands Manual for EC25...
  • Page 92 LTE Module Series EG91 Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GMSK Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access...
  • Page 93 LTE Module Series EG91 Hardware Design Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink UMTS Universal Mobile Telecommunications System Unsolicited Result Code (U)SIM...
  • Page 94 LTE Module Series EG91 Hardware Design Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG91_Hardware_Design 93 / 93...

  • Page 95: Appendix B Gprs Coding Schemes

    LTE Module Series EG91 Hardware Design Appendix B GPRS Coding Schemes Table 48: Description of Different Coding Schemes CS-1 CS-2 CS-3 CS-4 Scheme Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits 9.05 13.4 15.6 21.4 Data Rate Kb/s EG91_Hardware_Design...
  • Page 96 LTE Module Series EG91 Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 97 LTE Module Series EG91 Hardware Design EG91_Hardware_Design 96 / 93...
  • Page 98 LTE Module Series EG91 Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 50: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK...

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