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Quectel EG060K Series Hardware Design

Quectel EG060K Series Hardware Design

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EG060K &EG120KSeries
Hardware Design
LTE-A Module Series
Version: 1.0
Date: 2022-03-24
Status: Released
EG060K-EA&EG120K-EA_Hardware_Design
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  • Page 1 EG060K &EG120KSeries Hardware Design LTE-A Module Series Version: 1.0 Date: 2022-03-24 Status: Released EG060K-EA&EG120K-EA_Hardware_Design 1 / 103...
  • Page 2 LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...
  • Page 3 Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for your failure to comply with these precautions.

  • Page 5: About The Document

    LTE-A Module Series About the Document Revision History Version Date Author Description Elliot CAO/ 2022-01-28 Lewis PENG/ Creation of the document Jacen HUANG Elliot CAO/ 2022-03-24 Lewis PENG/ Released Jacen HUANG EG060K &EG120K _Series_Hardware_Design 4 / 103...

  • Page 6: Table Of Contents

    LTE-A Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................7 Figure Index ..............................9 Introduction ............................11 1.1. Special Marks .......................... 13 Product Overview ..........................14 2.1. Frequency Bands and Functions ..................... 14 2.2.
  • Page 7 LTE-A Module Series 4.7.2. Module Status Indication ....................55 4.8. RI ............................. 56 4.9. PCIe Interface .......................... 56 4.10. SDIO Interface* ........................58 4.11. Antenna Tuner Control Interfaces* ..................60 4.12. USB_BOOT Interface ......................60 RF Specifications ..........................62 5.1. Cellular Network ........................
  • Page 8 LTE-A Module Series Table Index Table 1: Special Marks ............................13 Table 2: Frequency Bands and GNSS Types of EG060K& EG120KSeries ............. 14 Table 3: Key Features ............................15 Table 4: I/O Parameters Definition ........................21 Table 5: Pin Description ............................ 21 Table 6: Overview of Operating Modes ......................
  • Page 9 LTE-A Module Series Table 40: Power Supply Ratings ........................77 Table 41: EG060K-EA Power Consumption ..................... 77 Table 42: EG120K-EA Power Consumption ..................... 79 Table 42: EG060K-NA & EG120K-NA Power Consumption ................80 Table 41: EG060K-LA Power Consumption ...................... 81 Table 42: EG120K-LA Power Consumption ......................
  • Page 10 LTE-A Module Series Figure Index Figure 1: Functional Diagram ..........................19 Figure 2: Pin Assignment (Top View) ........................ 21 Figure 3: DRX Run Time and Power Consumption in Sleep Mode ..............30 Figure 4: Sleep Mode Application via UART Interfaces ..................30 Figure 5: Sleep Mode Application with USB Remote Wake-up ................
  • Page 11 LTE-A Module Series Figure 42: Module Bottom Dimensions (Bottom View, Unit: mm) ..............89 Figure 43: Recommended Footprint (Top View, Unit: mm) ................90 Figure 44: Top and Bottom Views of EG060K-EA .................... 91 Figure 45: Top and Bottom Views of EG060K-NA .................... 91 Figure 45: Top and Bottom Views of EG060K-LA .....................

  • Page 12: Introduction

    LTE-A Module Series Introduction This document defines EG060K and EG120K series modules and describes their air and hardware interfaces which are connected to your applications. With this document, you can quickly understand module interface, electrical and mechanical specifications, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
  • Page 13 LTE-A Module Series when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: EG120K-NA: “Contains Transmitter Module FCC ID: XMR2022EG120KNA”...

  • Page 14: Special Marks

    LTE-A Module Series de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre é metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product;...

  • Page 15: Product Overview

    LTE-A Module Series Product Overview The module is a LTE-FDD/LTE-TDD/WCDMA wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. The module supports embedded operating systems such as Windows, Linux and Android. It also provides GNSS and voice functionality to meet specific application demands.

  • Page 16: Key Features

    LTE-A Module Series Mode EG060K-LA EG120K-LA LTE-FDD /B5/B7 /B8/B25 /B28/B66 /B5/B7 /B8/B25 /B28/B66 (with Rx-diversity) LTE-TDD /B43 /B43 (with Rx-diversity) WCDMA B2/B4/B5/B8 B2/B4/B5/B8 (with Rx-diversity) GNSS GPS, GLONASS, BDS, Galileo GPS, GLONASS, BDS, Galileo With a compact profile of 37.0 mm × 39.5 mm × 2.8 mm, the module meets most of requirements for M2M applications such as security, 4G router, CPE, wireless POS terminal, mobile computing device, PDA phone, and tablet PC.
  • Page 17 LTE-A Module Series ⚫ TDD: Max. 226 Mbps (DL)/28 Mbps (UL) ⚫ EG120K-EA ⚫ Supports 3GPP Rel-12 Cat 12 FDD and TDD ⚫ Supports uplink QPSK,16QAM and 64QAM modulation ⚫ Supports downlink QPSK, 16QAM, 64QAM and 256QAM modulation ⚫ Supports 1.4 MHz to 60 MHz (3CA) RF bandwidth ⚫...
  • Page 18 LTE-A Module Series ⚫ Max. transmission data rates: DC-HSDPA: 42 Mbps DC-HSUPA: 5.76 Mbps WCDMA: 384 kbps (DL)/384 kbps (UL) Internet Protocol Features Supports QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M*/PING* protocols ⚫ Text and PDU mode ⚫ Point-to-point MO and MT ⚫ SMS cell broadcast ⚫...
  • Page 19 Protocol: NMEA 0183 ⚫ Data update rate: 1 Hz ⚫ Complies with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands Two pins (NET_MODE and NET_STATUS) indicate network connectivity Network Indication status ⚫ ANT[0:3] ⚫...

  • Page 20: Functional Diagram

    LTE-A Module Series 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. ⚫ Power management ⚫ Baseband ⚫ LPDDR2 SDRAM + NAND flash ⚫ Radio frequency ⚫ Peripheral interfaces ANT_ GNSS ANT0 ANT2 ANT1...

  • Page 21: Pin Assignment

    LTE-A Module Series 2.4. Pin Assignment VBAT_RF VBAT_RF VBAT_RF VBAT_RF VDD_P2 DBG_RXD DBG_TXD USIM2_CLK USIM2_RST USB_BOOT USIM2_DET USIM2_DATA OTG_PWR_EN SLEEP_IND USIM2_VDD COEX_TXD RFFE_DATA COEX_RXD NET_MODE RFFE_CLK WLAN_EN WAKEUP_IN PCM_DOUT W_DISABLE# PCM_CLK I2S_MCLK PCM_DIN PCM_SYNC VBAT_BB VBAT_BB MAIN_DTR MAIN_RI MAIN_TXD MAIN_DCD WAKE_ MAIN_RXD ON_WIRELESS...

  • Page 22: Pin Description

    LTE-A Module Series Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED pins and unused pins unconnected. GND pins should be connected to ground in the design. 2.5. Pin Description Table 4: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input...
  • Page 23 LTE-A Module Series Provide 1.8 V for Vnom = 1.8 V VDD_EXT external circuit. max = 50 mA Provide 2.85 V for Vnom = 2.7 V VDD_RF If unused, keep it open. external RF circuit. max = 120 mA 10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81–84, 89, 90, 92–94, 96– 100, 102–106, 108–112, 114–118, 120–126, 128–133, 141, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196, 202–208, 214–299 Turn On/Off...
  • Page 24 LTE-A Module Series USIM1_RST (U)SIM1 card reset USIM1_DATA (U)SIM1 card data High-voltage: Vmax = 3.05 V Vnom = 2.85 V Vmin = 2.7 V (U)SIM2 card power If (U)SIM2 interface is USIM2_VDD supply unused, keep it open. Low-Voltage: Vmax = 1.95 V Vnom = 1.8 V Vmin = 1.65 V If (U)SIM2 interface is...
  • Page 25 LTE-A Module Series SDIO Interface* Pin Name Pin No. Description DC Characteristics Comment If a SD card is used, connect VDD_P2 to Power input for VDD_P2 SDIO_VDD. SDIO interface If unused, connect VDD_P2 to VDD_EXT. High-voltage: Vmax = 3.05 V Vnom = 2.85 V Cannot work as SD card Vmin = 2.7 V...
  • Page 26 LTE-A Module Series Main UART ring MAIN_RI indication Pulled up by default. Pulling low will awaken the Main UART data MAIN_DTR module. terminal ready If unused, keep it open. Sleep mode control. Debug UART Interface Pin Name Pin No. Description DC Characteristics Comment DBG_RXD...
  • Page 27 LTE-A Module Series Output signal in master mode. PCM_CLK PCM clock Input signal in slave mode. If unused, keep it open. PCM_DOUT PCM data output If unused, keep it open. Provide a digital clock output Clock output for I2S_MCLK for an external codec. codec If unused, keep it open.
  • Page 28 LTE-A Module Series ADC interface ADC1 PCIe Interface Pin Name Pin No. Description DC Characteristics Comment PCIE_ PCIe reference clock REFCLK_P PCIE_ PCIe reference clock Require differential REFCLK_M impedance of 95 Ω. PCIE_TX_M PCIe transmission (-) If unused, keep them open.Require differential PCIE_TX_P PCIe transmission (+)

  • Page 29: Evb

    172, 176, 192–195, 197–201, 209–213 unconnected. 2.6. EVB To help you develop applications conveniently with the module, Quectel supplies an evaluation board (EVB) with accessories to control and test the module. For more details, see document [1]. EG060K &EG120K _Series_Hardware_Design...

  • Page 30: Operating Characteristics

    LTE-A Module Series Operating Characteristics 3.1. Operating Modes Table 6: Overview of Operating Modes Mode Details Software is active. The module has registered on the network, and Idle it is ready to send and receive data. Normal Operation Mode Network is connected. In this mode, the power consumption is Voice/Data decided by network setting and data transfer rate.

  • Page 31: Uart Application

    LTE-A Module Series the DRX cycle is, the lower the power consumption will be. DRX OFF Run Time Figure 3: DRX Run Time and Power Consumption in Sleep Mode The following part of this section presents the power saving procedure and sleep mode of the module. 3.1.1.1.

  • Page 32: Usb Application

    LTE-A Module Series 3.1.1.2. USB Application USB application can be applied with USB remote wake-up function or USB suspend/resume and RI functions. ⚫ If the host supports USB suspend/resume and remote wake-up function, meeting the following three requirements will bring the module into sleep mode. Keep MAIN_DTR high (pulled up by default).
  • Page 33 LTE-A Module Series Module Host USB_VBUS USB Interface USB Interface MAIN_RI EINT Figure 6: Sleep Mode Application with MAIN_RI Sending data to the module through USB will awaken the module. When the module has a URC to report, MAIN_RI will wake up the host. ⚫...

  • Page 34: Airplane Mode

    LTE-A Module Series NOTE Please heed the level-shifting of the connection shown in dotted line between the module and the host. 3.1.2. Airplane Mode The module provides W_DISABLE# to disable or enable airplane mode via hardware operation. W_DISABLE# is pulled up by default. Driving it low will bring the module into airplane mode. Table 7: Pin Description of W_DISABLE# Pin Name Pin No.

  • Page 35: Power Supply

    LTE-A Module Series 3.2. Power Supply 3.2.1. Power Supply Pins The module provides six VBAT pins dedicated to the connection to an external power supply. There are two separate voltage domains for VBAT. ⚫ Four VBAT_RF pins for module’s RF part. ⚫...

  • Page 36: Reference Design For Power Supply

    LTE-A Module Series To decrease voltage drop, at least one bypass capacitor of about 100 µF with low ESR and one multi- layer ceramic chip (MLCC) capacitor array for its ultra-low ESR should be used for VBAT_BB/RF. It is recommended to adopt ceramic capacitors for composing the MLCC array, and place these capacitors close to VBAT pins.

  • Page 37: Power Supply Voltage Monitoring

    LTE-A Module Series MIC29302WU DC_IN VBAT 100K 470R 4.7K 470 μF 100 nF 470 μF 100 nF VBAT_EN Figure 10: Reference Circuit of Power Supply NOTE To avoid internal flash damage, do not switch off the power supply when the module works normally. The power supply can only be cut off after the module is shut down by PWRKEY or AT commands.
  • Page 38 LTE-A Module Series PWRKEY ≥ 500 ms 4.7K Turn on pulse Figure 11: Turn On the Module with a Driving Circuit The other way to control PWRKEY is using a button directly. Electrostatic strike may generate from fingers as you pressing the key. Therefore, it is necessary to place a TVS near the button for ESD protection.

  • Page 39: Turn Off

    LTE-A Module Series NOTE VBA T 500 ms 1.3 V PWRKEY 0.5 V RESET_N STATUS 10 s MAIN_ Inactive Active UART 15 s Inactive Active Figure 13: Timing of Turning On Module NOTE Make sure VBAT has been stable for over 30 ms before pulling down PWRKEY. If the module needs to be powered on automatically and power-off is not needed, PWRKEY can be pulled down directly to GND with a recommended 10 kΩ...

  • Page 40: Turn Off With At Command

    LTE-A Module Series VBA T 800 ms PWRKEY STATUS Module Power-down procedure RUNNING Status Figure 14: Timing of Turning Off the Module 3.4.2. Turn Off with AT Command It is also a safe manner to turn off the module via AT+QPOWD command. NOTE To avoid damaging internal flash data, do not switch off the power supply when the module works normally.
  • Page 41 LTE-A Module Series control RESET_N. 250–600 ms RESET_N Reset pulse 4. 7K G P I O M C U M odul e Figure 15: Reference Circuit of RESET_N with a Driving Circuit The reset scenario is illustrated in the following figure. VBAT ≤...

  • Page 42: Application Interfaces

    LTE-A Module Series Application Interfaces The module is designed with 299 LGA pins that can be connected to cellular application platform. This chapter mainly describes the following application interfaces and indication signals of the module: ⚫ (U)SIM ⚫ ⚫ UART ⚫...

  • Page 43: U)Sim Interfaces

    LTE-A Module Series 4.1. (U)SIM Interfaces The module provides two (U)SIM interfaces. The circuitry of (U)SIM interfaces meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported, and Dual SIM Single Standby function is supported. (U)SIM card hot-plug is enabled by AT+QUIMSLOT command. See document [4] for details about the AT command.
  • Page 44 LTE-A Module Series VDD_EXT USIM_VDD 100 nF (U)SIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DET USIM_DATA NM NM TVS array Figure 17: Reference Circuit of a (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is unnecessary, keep USIM_DET open. A reference circuit for a (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

  • Page 45: Usb Interface

    LTE-A Module Series ⚫ Keep (U)SIM card signals away from RF and VBAT traces. ⚫ Make sure the ground between the module and the (U)SIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential.
  • Page 46 LTE-A Module Series For more details about the USB 2.0 and USB 3.0 specifications, visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in your designs. The following figure shows a reference circuit of USB 2.0 and USB 3.0 interfaces. Test Points Minimize these stubs Module...

  • Page 47: Uart Interfaces

    LTE-A Module Series ⚫ Do not route signal traces under crystals, oscillators, magnetic devices, PCIe and RF signal traces. It is vital to route the USB differential traces in inner-layers of the PCB, and surround the traces with ground on that layer and with ground planes above and below. ⚫...

  • Page 48: Main Uart Interface

    LTE-A Module Series 4.3.1. Main UART Interface Table 15: Pin Definition of Main UART Interface Pin Name Pin No. Description Comment MAIN_CTS DCE clear to send signal to DTE DCE request to send signal from MAIN_RTS 1.8 V power domain. MAIN_RXD Main UART receive If unused, keep them...

  • Page 49: Uart Application

    LTE-A Module Series Table 17: Pin Definition of Bluetooth UART Interface Multiplexed Pin Name Pin No. Description Comment Function BT_EN Bluetooth function enable control 1.8 V power SPI_MOSI BT_TXD Bluetooth UART transmit domain. SPI_CLK BT_CTS DCE clear to send signal to DTE If unused, keep them SPI_MISO...

  • Page 50: Spi Interface

    LTE-A Module Series 4.7K VDD_EXT VDD_EXT 1 nF Module MCU/ARM 1 nF VDD_EXT VCC_MCU 4.7K GPIO EINT GPIO Figure 21: Reference Circuit with MOSFETs NOTE Transistor circuit solution is not suitable for applications with high baud rates over 460 kbps. 4.4.

  • Page 51: Pcm And I2C Interfaces

    LTE-A Module Series PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN SPI_CS SPI_CLK SPI_DOUT SPI_DIN SLIC Module Figure 22: Reference Circuit of PCM and SPI Application with SLIC 4.5. PCM and I2C Interfaces The module supports audio communication via PCM (Pulse Code Modulation) digital interface and I2C interfaces.
  • Page 52 LTE-A Module Series 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 23: Primary Mode Timing 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 24: Auxiliary Mode Timing The following table shows the pin definition of the PCM interface and I2C interface, both of which can be applied to audio codec design.
  • Page 53 LTE-A Module Series Table 19: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. Description Comment PCM_DIN PCM data input 1.8 V power domain. If unused, keep them open. PCM_DOUT PCM data output PCM data frame 1.8 V power domain. PCM_SYNC sync Output signal in master mode.

  • Page 54: Adc Interfaces

    LTE-A Module Series NOTE The module works as a master device pertaining to I2C interface. 4.6. ADC Interfaces The module provides two ADC (Analog-to-Digital Converter) interfaces. Execute AT+QADC=0 command to read the voltage value on ADC0. Execute AT+QADC=1 to read the voltage value on ADC1. See document [4] for details about these AT commands.

  • Page 55: Status Indication

    LTE-A Module Series 4.7. Status Indication 4.7.1. Network Status Indication The network indication pins NET_MODE and NET_STATUS can be used to drive network status indication LEDs. Their definitions and logic level changes upon the switch of network mode/status, which is described in the following tables. Table 22: Pin Definition of NET_MODE and NET_STATUS Pin Name Pin No.

  • Page 56: Module Status Indication

    LTE-A Module Series A reference circuit is shown in the following figure. Module VBAT 2.2K 4.7K Network Indicator Figure 26: Reference Circuit of the Network Indicator 4.7.2. Module Status Indication The STATUS pin is set as the module’s status indicator. It outputs high level voltage when the module is turned on.

  • Page 57: Pcie Interface

    LTE-A Module Series 4.8. RI Execute AT+QCFG="risignaltype","physical" command to configure MAIN_RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI. The behavior of MAIN_RI can be altered by executing AT+QCFG="urc/ri/ring" command. See document [4] for details about these AT commands.
  • Page 58 LTE-A Module Series PCIE_TX_M PCIe transmit (-) PCIE_TX_P PCIe transmit (+) PCIE_RX_M PCIe receive (-) PCIE_RX_P PCIe receive (+) Input signal in master mode. PCIE_CLKREQ_N PCIe clock request If unused, keep it open. Output signal in master mode. PCIE_RC_RST_N PCIe RC reset If unused, keep it open.

  • Page 59: Sdio Interface

    LTE-A Module Series Table 27: PCIe Trace Length Inside the Module Pin No. Signal Trace Length (mm) Length Difference (mm) PCIE_REFCLK_P 22.24 PCIE_REFCLK_M 22.14 PCIE_TX_M 17.99 0.08 PCIE_TX_P 17.91 PCIE_RX_M 13.91 0.07 PCIE_RX_P 13.98 4.10. SDIO Interface* The module provides one SDIO interface which supports SD 3.0 protocol and eMMC*. The following table shows the pin definition.
  • Page 60 LTE-A Module Series SDIO_DET SD card detect If unused, keep it open. SDIO_CLK SDIO clock If unused, keep it open. The following figure shows an SDIO interface reference design. Module SD Card Connector VDD_EXT VDD_2V95 SDIO_VDD 100 μF 100 nF 33 pF 10pF 100K...

  • Page 61: Antenna Tuner Control Interfaces

    LTE-A Module Series 4.11. Antenna Tuner Control Interfaces* The module supports external antenna tuner control through the RFFE interface. The following is the pin definition of the RFFE interfaces. Table 29: Pin Definition of RFFE Interfaces for Antenna Tuner Control Pin Name Pin No.
  • Page 62 LTE-A Module Series The following figure shows a reference circuit of USB_BOOT. Module VDD_EXT Test point USB_BOOT Figure 30: Reference Circuit of USB_BOOT EG060K &EG120K _Series_Hardware_Design 61 /...

  • Page 63: Rf Specifications

    LTE-A Module Series RF Specifications The module provides one main antenna interface, one Rx-diversity antenna interface, two MIMO antenna interfaces, and one GNSS antenna interface. The impedance of antenna port is 50 Ω. 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna interface, Rx-diversity antenna interface and MIMO antenna interfaces is shown as below.
  • Page 64 LTE-A Module Series WCDMA B8 880–915 925–960 LTE B1 1920–1980 2110–2170 LTE B2 1850-1910 1930-1990 LTE B3 1710–1785 1805–1880 LTE B4 1710-1755 2110-2155 LTE B5 824–849 869–894 LTE B7 2500–2570 2620–2690 LTE B8 880–915 925–960 LTE B12 699-716 729-746 LTE B13 777-787 746-756 LTE B14...

  • Page 65: Tx Power

    LTE-A Module Series LTE B71 663-698 617-652 5.1.2. Tx Power Table 33: Tx Power Frequency Bands Max. Tx Power Min. Tx Power WCDMA bands 23 dBm ± 2 dB < -50 dBm LTE bands 23 dBm ± 2 dB < -40 dBm 5.1.3.
  • Page 66 LTE-A Module Series LTE-FDD B32 (10 MHz) -96.4 -96.5 -96.3 dBm LTE-TDD B38 (10 MHz) -96.3 -96.4 -98.8 -96.3 dBm LTE-TDD B40 (10 MHz) -98.2 -96.3 dBm LTE-TDD B41 (10 MHz) -95.8 -98.5 -94.3 dBm Table 35: EG060K-NA & EG120K-NA Dual-Antenna Conducted RF Rx Sensitivity Primary Diversity Frequency Bands...
  • Page 67 LTE-A Module Series Table 36: EG060K-LA & EG120K-LA Dual-Antenna Conducted RF Rx Sensitivity Primary Diversity Frequency Bands SIMO (dBm) 3GPP (SIMO) (dBm) (dBm) WCDMA B2 -104.7 dBm WCDMA B4 -106.7 dBm WCDMA B5 -104.7 dBm WCDMA B8 -103.7 dBm LTE-FDD B2 (10 MHz) -94.3 dBm LTE-FDD B4 (10 MHz) -96.3 dBm...

  • Page 68: Reference Design

    LTE-A Module Series LTE-TDD B40 (10 MHz) -101.5 -99 dBm LTE-TDD B41 (10 MHz) -101.5 -97 dBm Table 36: EG060K-NA & EG120K-NA Four-Antenna Conducted RF Rx Sensitivity Frequency Bands SIMO (dBm) 3GPP (SIMO) LTE-FDD B2 (10 MHz) -97 dBm LTE-FDD B4 (10 MHz) -99 dBm LTE-FDD B7 (10 MHz) -97 dBm...
  • Page 69 LTE-A Module Series matching circuit for better RF performance. The π-type matching components (R1/C1/C2, R2/C3/C4, R3/C5/C6, R4/C7/C8) should be placed as close to the antennas as possible and are mounted according to the actual debugging. C1 to C8 are not mounted and a 0 Ω resistor is mounted on R1 to R4 respectively by default.

  • Page 70: Gnss

    LTE-A Module Series 5.2. GNSS 5.2.1. Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BDS, and Galileo. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is off.

  • Page 71: Reference Design

    LTE-A Module Series Autonomous Cold start @ open sky XTRA enabled Autonomous Warm start TTFF @ open sky XTRA enabled Autonomous Hot start @ open sky XTRA enabled Autonomous Accuracy CEP-50 @ open sky NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).

  • Page 72: Rf Routing Guidelines

    LTE-A Module Series NOTE An external LDO can be used to supply power according to the active antenna requirements. The VDD circuit is unnecessary if the module is equipped with a passive antenna. 5.3. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’...
  • Page 73 LTE-A Module Series Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...

  • Page 74: Antenna Design Requirements

    LTE-A Module Series 5.4. Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 40: Antenna Design Requirements Antenna Type Requirements ⚫ Frequency range: 1559–1609 MHz ⚫ Polarization: RHCP or linear ⚫ VSWR: <...
  • Page 75 LTE-A Module Series Figure 37: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connector listed in the following figure can be used to match the U.FL-R-SMT. Figure 38: Mechanicals of U.FL-LP Connectors EG060K &EG120K _Series_Hardware_Design 74 /...
  • Page 76 LTE-A Module Series The following figure describes the space factor of mating plugs. Figure 39: Space Factor of Mating Plugs (Unit: mm) For more details, please visit http://www.hirose.com. EG060K &EG120K _Series_Hardware_Design 75 /...

  • Page 77: Electrical Characteristics And Reliability

    LTE-A Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 41: Absolute Maximum Ratings Parameter Min. Max.

  • Page 78: Power Consumption

    LTE-A Module Series Table 42: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages VBAT_BB and must remain between the VBAT VBAT_RF minimum and the maximum values. USB connection USB_VBUS 5.25 detection 6.3. Power Consumption Table 43: EG060K-EA Power Consumption Description Conditions...
  • Page 79 LTE-A Module Series LTE-FDD PF = 64 (USB 2.0 connected) 17.71 LTE-TDD PF = 64 (USB disconnected) 11.94 LTE-TDD PF = 64 (USB 2.0 connected) 18.20 WCDMA B1 HSDPA CH10700 @ 22.22 dBm WCDMA B1 HSUPA CH10700 @ 21.34 dBm WCDMA B3 HSDPA CH1338 @ 22.31 dBm WCDMA data WCDMA B3 HSUPA CH1338 @ 21.53 dBm...
  • Page 80 LTE-A Module Series Table 44: EG120K-EA Power Consumption Description Conditions Typ. Unit μA OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) 2.71 WCDMA PF = 128 (USB disconnected) 2.11 WCDMA PF = 512 (USB disconnected) 1.64 LTE-FDD PF = 32 (USB disconnected) 4.32...
  • Page 81 LTE-A Module Series WCDMA B8 HSDPA CH3012 @ 22.21 dBm WCDMA B8 HSUPA CH3012 @ 20.94 dBm LTE-FDD B1 CH300 @ 22.78 dBm LTE-FDD B3 CH1575 @ 22.73 dBm LTE-FDD B5 CH2525 @ 22.96 dBm LTE-FDD B7 CH3100 @ 23.13 dBm LTE data LTE-FDD B8 CH3625 @ 22.81 dBm transfer...
  • Page 82 LTE-A Module Series LTE-FDD B13 LTE-FDD B14 LTE-FDD B25 LTE-FDD B26 LTE-FDD B30 LTE-TDD B41 LTE-TDD B48 LTE-FDD B66 LTE-FDD B71 Table 46: EG060K-LA Power Consumption Description Conditions Typ. Unit μA OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 32 (USB disconnected)
  • Page 83 LTE-A Module Series LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 64 (USB 2.0 connected) LTE-TDD PF = 64 (USB disconnected) LTE-TDD PF = 64 (USB 2.0 connected) WCDMA B2 HSDPA CH9800 @ TBD dBm WCDMA B2 HSUPA CH9800 @ TBD dBm WCDMA B4 HSDPA CH1638 @ TBD dBm WCDMA data WCDMA B4 HSUPA CH1638 @ TBD dBm...
  • Page 84 LTE-A Module Series WCDMA B8 CH3012 @ TBD dBm Table 47: EG120K-LA Power Consumption Description Conditions Typ. Unit μA OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) WCDMA PF = 512 (USB disconnected) LTE-FDD PF = 32 (USB disconnected) Sleep state LTE-FDD PF = 64 (USB disconnected)

  • Page 85: Digital I/O Characteristics

    LTE-A Module Series WCDMA B5 HSDPA CH4408 @ TBD dBm WCDMA B5 HSUPA CH4408 @ TBD dBm WCDMA B8 HSDPA CH3012 @ TBD dBm WCDMA B8 HSUPA CH3012 @ TBD dBm LTE-FDD B2 CH900 @ TBD dBm LTE-FDD B4 CH2175 @ TBD dBm LTE-FDD B5 CH2525 @ TBD dBm LTE-FDD B7 CH3100 @ TBD dBm LTE data...
  • Page 86 LTE-A Module Series Input low voltage -0.3 0.3 × VDD_EXT Output high voltage VDD_EXT - 0.45 VDD_EXT Output low voltage 0.45 Table 49: SDIO_VDD Low-voltage I/O Requirements Parameter Description Min. Max. Unit Input high voltage 1.27 Input low voltage -0.3 0.58 Output high voltage SDIO_VDD...

  • Page 87: Esd Protection

    LTE-A Module Series 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

  • Page 88: Thermal Dissipation

    LTE-A Module Series 6.7. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent.

  • Page 89: Mechanical Information

    LTE-A Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Pin 1 Figure 41: Module Top and Side Dimensions (Top View) EG060K &EG120K _Series_Hardware_Design 88 /...
  • Page 90 LTE-A Module Series Pin 1 Figure 42: Module Bottom Dimensions (Bottom View, Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG060K &EG120K _Series_Hardware_Design 89 /...

  • Page 91: Recommended Footprint

    LTE-A Module Series 7.2. Recommended Footprint Pin 1 Figure 43: Recommended Footprint (Top View, Unit: mm) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG060K &EG120K _Series_Hardware_Design 90 /...

  • Page 92: Top And Bottom Views

    LTE-A Module Series 7.3. Top and Bottom Views Figure 44: Top and Bottom Views of EG060K-EA Figure 45: Top and Bottom Views of EG060K-NA EG060K &EG120K _Series_Hardware_Design 91 /...
  • Page 93 LTE-A Module Series Figure 46: Top and Bottom Views of EG060K-LA Figure 47: Top and Bottom Views of EG120K-EA Figure 48: Top and Bottom Views of EG120K-NA EG060K &EG120K _Series_Hardware_Design 92 /...
  • Page 94 LTE-A Module Series Figure 49: Top and Bottom Views of EG120K-LA NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, see the module received from Quectel. EG060K &EG120K _Series_Hardware_Design 93 /...

  • Page 95: Storage, Manufacturing & Packaging

    LTE-A Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided in vacuum-sealed packaging. MSL of the module is rated at 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 96: Manufacturing And Soldering

    LTE-A Module Series 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.
  • Page 97 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [6].

  • Page 98: Packaging Specifications

    LTE-A Module Series 8.3. Packaging Specifications The module adopts carrier tape packaging and details are as follow: 8.3.1. Carrier Tape Dimension details are as follow: Figure 51: Carrier Tape Dimension Drawing Table 55: Carrier Tape Dimension Table (Unit: mm) 0.35 37.5 26.2 1.75...

  • Page 99: Plastic Reel

    LTE-A Module Series 8.3.2. Plastic Reel Figure 52: Plastic Reel Dimension Drawing Table 56: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 56.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 100 LTE-A Module Series Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 800 modules. Figure 53: Packaging Process EG060K &EG120K _Series_Hardware_Design 99 /...

  • Page 101: Appendix References

    LTE-A Module Series Appendix References Table 57: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_R2.0_User_Guide [2] Quectel_EG060K-EA_CA_Feature [3] Quectel_EG120K-EA_CA_Feature [4] Quectel_EG060K-EA&EG120K-EA_AT_Commands_Manual [5] Quectel_RF_Layout_Application_Note [6] Quectel_Module_Secondary_SMT_Application_Note Table 58: Term and Abbreviation Abbreviation Description Adaptive Multi-Rate AMR-WB Adaptive Multi-Rate Wideband bit(s) per second CHAP Challenge-Handshake Authentication Protocol Customer Premise Equipment Coding Scheme...
  • Page 102 LTE-A Module Series Downlink Discontinuous Reception Data Terminal Ready Discontinuous Transmission eMMC Embedded Multi Media Card Enhanced Full Rate Electrostatic Discharge Evaluation Board Full Rate GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System Global Positioning System Half Rate HSPA+...
  • Page 103 LTE-A Module Series Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circular Polarization Receive SD Card Secure Digital Card SIMO Single Input Multiple Output SLIC Subscriber Line Interface Circuit Short Message Service Time Division Duplex Transmit...
  • Page 104 LTE-A Module Series EG060K &EG120K _Series_Hardware_Design 103 /...

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