Quectel EG95-E Hardware Manual
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Quectel EG95-E Hardware Manual

Eg95 lte module series
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EG95
Hardware Design
LTE Module Series
Rev. EG95_Hardware_Design_V1.2
Date: 2018-03-14
Status: Released
www.quectel.com

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Summary of Contents for Quectel EG95-E

  • Page 1 EG95 Hardware Design LTE Module Series Rev. EG95_Hardware_Design_V1.2 Date: 2018-03-14 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Module Series EG95 Hardware Design About the Document History Revision Date Author Description Felix YIN/ 2017-03-22 Yeoman CHEN/ Initial Jackie WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4.
  • Page 4 LTE Module Series EG95 Hardware Design Updated module operating frequencies in Table 22. 10. Added description GNSS antenna interface in Chapter 5.2. 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. EG95_Hardware_Design 3 / 81...

  • Page 5: Table Of Contents

    LTE Module Series EG95 Hardware Design Contents About the Document ........................... 2 Contents ............................... 4 Table Index ..............................6 Figure Index ..............................7 Introduction ............................9 Safety Information........................10 1.1. Product Concept ..........................11 General Description ......................... 11 2.1. Key Features ........................... 12 2.2.
  • Page 6 LTE Module Series EG95 Hardware Design STATUS ........................... 46 3.15. Behaviors of RI ........................47 3.16. GNSS Receiver ........................... 48 General Description ......................... 48 4.1. GNSS Performance ......................... 48 4.2. Layout Guidelines ........................49 4.3. Antenna Interfaces ..........................50 Main/Rx-diversity Antenna Interfaces..................50 5.1.
  • Page 7 TABLE 31: GNSS CURRENT CONSUMPTION OF EG95-NA ................. 63 TABLE 32: RF OUTPUT POWER ........................63 TABLE 33: EG95-E CONDUCTED RF RECEIVING SENSITIVITY ..............64 TABLE 34: EG95-NA CONDUCTED RF RECEIVING SENSITIVITY ............... 65 TABLE 35: ELECTROSTATIC DISCHARGE CHARACTERISTICS ..............65 TABLE 36: RELATED DOCUMENTS ........................
  • Page 8 LTE Module Series EG95 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 15 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................... 17 FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................25 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............ 26 FIGURE 5: SLEEP MODE APPLICATION WITH RI ..................
  • Page 9 LTE Module Series EG95 Hardware Design FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............57 FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....66 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB) . 67 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................

  • Page 10: Introduction

    LTE Module Series EG95 Hardware Design Introduction This document defines the EG95 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG95 module. Associated with application note and user guide, customers can use EG95 module to design and set up mobile applications easily.

  • Page 11: Safety Information

    EG95 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 12: Product Concept

    The following table shows the frequency functionality bands of EG95 module. Table 1: Frequency Bands of EG95 Module LTE Bands WCDMA Module GNSS (with Rx-diversity) (with Rx-diversity) FDD: EG95-E B1/B8 900/1800MHz Not supported B1/B3/B7/B8/B20/B28A GPS, GLONASS, EG95-NA* FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported BeiDou/Compass,...

  • Page 13: Key Features

    LTE Module Series EG95 Hardware Design 2.2. Key Features The following table describes the detailed features of EG95 module. Table 2: Key Features of EG95 Module Feature Details Supply voltage: 3.3V~4.3V Power Supply Typical supply voltage: 3.8V Class 4 (33dBm± 2dB) for EGSM900 Class 1 (30dBm±...
  • Page 14 Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm GNSS Features Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Network Indication NETLIGHT pin for network activity status indication Including main antenna interface (ANT_MAIN), Rx-diversity antenna...

  • Page 15: Functional Diagram

    LTE Module Series EG95 Hardware Design Weight: approx. 3.8g Operation temperature range: -35° C ~ +75° C Temperature Range Extended temperature range: -40° C ~ +85° C Storage temperature range: -40°C ~ +90°C Firmware Upgrade USB interface and DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES GNSS antenna interface is only supported on EG95-NA.

  • Page 16: Evaluation Board

    GNSS antenna interface is only supported on EG95-NA. 2.4. Evaluation Board In order to help customers develop applications conveniently with EG95, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module.

  • Page 17: Application Interfaces

    LTE Module Series EG95 Hardware Design Application Interfaces 3.1. General Description EG95 is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters: ...

  • Page 18: Pin Assignment

    LTE Module Series EG95 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG95 module. ANT_GNSS (EG95-NA)/ RESERVED ANT_DIV (EG95-E) RESERVED USIM_GND PCM_CLK USIM1_CLK PCM_SYNC USIM1_DATA USIM2_PRESENCE PCM_DIN USIM1_RST PCM_DOUT USIM1_VDD USIM2_CLK USB_VBUS USIM1_PRESENCE USB_DP USIM2_RST...

  • Page 19: Pin Description

    Keep all RESERVED pins and unused pins unconnected. GND pads should be connected to ground in the design. Please note that the definition of pin 49 and 56 are different between EG95-E and EG95-NA. 3.3. Pin Description The following tables show the pin definition and description of EG95.
  • Page 20 LTE Module Series EG95 Hardware Design transmitting burst. Power supply for Provide 1.8V for Vnorm=1.8V VDD_EXT external GPIO’s pull up external circuit max=50mA circuits. 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, Ground 79~82, 89~91, 100~106 Turn on/off Pin Name Pin No.
  • Page 21 LTE Module Series EG95 Hardware Design (U)SIM Interfaces Pin Name Pin No. Description DC Characteristics Comment Specified ground for USIM_GND (U)SIM card For 1.8V (U)SIM: Vmax=1.9V USIM1_VDD Vmin=1.7V Either 1.8V or 3.0V is Power supply for supported by the (U)SIM card For 3.0V (U)SIM: module automatically.
  • Page 22 LTE Module Series EG95 Hardware Design Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it in=1.35V open. 1.8V power domain. Data carrier max=0.45V If unused, keep it detection in=1.35V open.
  • Page 23 LTE Module Series EG95 Hardware Design min=-0.3V 1.8V power domain. max=0.6V PCM_DIN PCM data input If unused, keep it min=1.2V open. max=2.0V 1.8V power domain. max=0.45V PCM_DOUT PCM data output If unused, keep it in=1.35V open. 1.8V power domain. max=0.45V In master mode, it is in=1.35V PCM data frame...
  • Page 24 DC Characteristics Comment 50Ω impedance. If unused, keep it ANT_GNSS (EG95- GNSS antenna pad open. Pin 49 is defined as ANT_DIV on EG95-E. 50Ω impedance. Receive diversity ANT_DIV If unused, keep it (EG95-E) antenna pad open. 50Ω impedance. If unused, keep it...

  • Page 25: Operating Modes

    LTE Module Series EG95 Hardware Design 1, 2, 11~14, 16, 18, 49, 51, Keep these pins RESERVED Reserved 57, 63~66, unconnected. 76~78, 88, 92~99 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details...

  • Page 26: Uart Application

    LTE Module Series EG95 Hardware Design 3.5.1.1. UART Application If the host communicates with the module via UART interface, the following preconditions can let the module enter into sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level. The following figure shows the connection between the module and the host.

  • Page 27: Usb Application With Usb Suspend/Resume And Ri Function

    LTE Module Series EG95 Hardware Design The following figure shows the connection between the module and the host. Host Module USB_VBUS USB_DP USB_DP USB_DM USB_DM GPIO AP_READY Figure 4: Sleep Mode Application with USB Remote Wakeup  Sending data to EG95 through USB will wake up the module. ...

  • Page 28: Usb Application Without Usb Suspend Function

    LTE Module Series EG95 Hardware Design  Sending data to EG95 through USB will wake up the module.  When EG95 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected with an external control circuit to let the module enter into sleep mode.

  • Page 29: Power Supply

    LTE Module Series EG95 Hardware Design Software: AT+CFUN command provides the choice of functionality levels as shown below:  AT+CFUN=0: Minimum functionality mode. Both (U)SIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled. NOTES Airplane mode control via W_DISABLE# is disabled in firmware by default.

  • Page 30: Decrease Voltage Drop

    LTE Module Series EG95 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.

  • Page 31: Reference Design For Power Supply

    LTE Module Series EG95 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.

  • Page 32: Table 7: Pin Definition Of Pwrkey

    LTE Module Series EG95 Hardware Design Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment max=2.1V The output voltage is 0.8V PWRKEY Turn on/off the module min=1.3V because of the diode drop in max=0.5V the Qualcomm chipset. When EG95 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms.

  • Page 33: Turn Off Module

    LTE Module Series EG95 Hardware Design The turn on scenario is illustrated in the following figure. NOTE VBAT ≥ 500ms ≥ 1.3V PWRKEY ≤ 0.5V RESET_N ≥ 10s STATUS ≥ 12s UART Inactive Active ≥ 13s Inactive Active Figure 12: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin.

  • Page 34: Turn Off Module Using At Command

    LTE Module Series EG95 Hardware Design VBAT ≥ 650ms ≥ 30s PWRKEY STATUS Module Power-down procedure RUNNING Status Figure 13: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY pin.

  • Page 35: Figure 14: Reference Circuit Of Reset_N By Using Driving Circuit

    LTE Module Series EG95 Hardware Design The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N. RESET_N 150ms~460ms 4.7K Reset pulse Figure 14: Reference Circuit of RESET_N by Using Driving Circuit RESET_N Close to S2 Figure 15: Reference Circuit of RESET_N by Using Button...

  • Page 36: U)Sim Interfaces

    LTE Module Series EG95 Hardware Design NOTES Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interfaces EG95 provides two (U)SIM interfaces, and only one (U)SIM card can work at a time. The (U)SIM 1 and (U)SIM 2 cards can be switched by AT+QDSIM command.

  • Page 37: Figure 18: Reference Circuit Of (U)Sim1 Interface With A 6-Pin (U)Sim Card Connector

    LTE Module Series EG95 Hardware Design EG95 supports (U)SIM card hot-plug via the USIM1_PRESENCE and USIM2_PRESENCE pins. The function supports low level and high level detections, and is disabled by default. Please refer to document [2] about AT+QSIMDET command for details. The following figure shows a reference design for (U)SIM1 interface with an 8-pin (U)SIM card connector.

  • Page 38: Figure 20: Reference Circuit Of (U)Sim2 Interface With A 6-Pin (U)Sim Card Connector

    LTE Module Series EG95 Hardware Design The following figure shows a reference design of (U)SIM2 interface with an 8-pin (U)SIM card connector. VDD_EXT USIM2_VDD 100nF (U)SIM Card Connector USIM_GND USIM2_VDD USIM2_RST Module USIM2_CLK USIM2_PRESENCE USIM2_DATA 33pF 33pF 33pF Figure 19: Reference Circuit of (U)SIM2 Interface with an 8-Pin (U)SIM Card Connector If (U)SIM2 card detection function is not needed, please keep USIM2_PRESENCE unconnected.

  • Page 39: Usb Interface

    LTE Module Series EG95 Hardware Design In order to enhance the reliability and availability of the (U)SIM cards in customers’ applications, please follow the criteria below in the (U)SIM circuit design:  Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible.

  • Page 40: Figure 21: Reference Circuit Of Usb Interface

    LTE Module Series EG95 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The following figure shows a reference circuit of USB interface. Test Points Minimize these stubs Module NM_0R NM_0R ESD Array USB_VBUS USB_DM USB_DM...

  • Page 41: Uart Interfaces

    LTE Module Series EG95 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps.

  • Page 42: Table 13: Logic Levels Of Digital I/O

    LTE Module Series EG95 Hardware Design The logic levels are described in the following table. Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit -0.3 0.45 1.35 The module provides 1.8V UART interface. A level translator should be used if customers’ application is equipped with a 3.3V UART interface.

  • Page 43: Pcm And I2C Interfaces

    LTE Module Series EG95 Hardware Design 4.7K VDD_EXT VDD_EXT Module MCU/ARM VDD_EXT VCC_MCU 4.7K GPIO EINT GPIO Figure 23: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG95 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: ...

  • Page 44: Figure 24: Primary Mode Timing

    LTE Module Series EG95 Hardware Design 125us PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 24: Primary Mode Timing 125us PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 25: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.

  • Page 45: Table 14: Pin Definition Of Pcm And I2C Interfaces

    LTE Module Series EG95 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. Description Comment PCM_DIN PCM data input 1.8V power domain PCM_DOUT PCM data output 1.8V power domain PCM data frame PCM_SYNC 1.8V power domain synchronization signal PCM_CLK PCM data bit clock...

  • Page 46: Spi Interface

    LTE Module Series EG95 Hardware Design 3.13. SPI Interface SPI interface of EG95 acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip select. Its operation voltage is 1.8V with clock rates up to 50MHz. The following table shows the pin definition of SPI interface.

  • Page 47: Status

    LTE Module Series EG95 Hardware Design Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. Description Comment NETLIGHT Indicate the module’s network activity status 1.8V power domain Table 17: Working State of the Network Status Indicator Pin Name Logic Level Changes Network Status Flicker slowly (200ms High/1800ms Low)

  • Page 48: Behaviors Of Ri

    LTE Module Series EG95 Hardware Design A reference circuit is shown as below. VBAT Module 2.2K 4.7K STATUS Figure 29: Reference Circuit of STATUS 3.16. Behaviors of RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port URC is presented, URC will trigger the behavior of RI pin. NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command.

  • Page 49: Gnss Receiver

    LTE Module Series EG95 Hardware Design GNSS Receiver 4.1. General Description EG95 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG95 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default.

  • Page 50: Layout Guidelines

    LTE Module Series EG95 Hardware Design @open sky XTRA enabled Accuracy Autonomous CEP-50 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.

  • Page 51: Antenna Interfaces

    Pin Name Pin No. Description Comment Main antenna pad 50Ω impedance ANT_MAIN ANT_DIV 50Ω impedance Receive diversity antenna pad (EG95-E) ANT_DIV 50Ω impedance Receive diversity antenna pad (EG95-NA) 5.1.2. Operating Frequency Table 22: Module Operating Frequencies 3GPP Band Transmit Receive...

  • Page 52: Reference Design Of Rf Antenna Interface

    LTE Module Series EG95 Hardware Design WCDMA B5 824~849 869~894 WCDMA B8 880~915 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE FDD B4 1710~1755 2110~2155 LTE FDD B5 824~849 869~894 LTE-FDD B7 2500~2570 2620~2690 LTE-FDD B8 880~915...

  • Page 53: Reference Design Of Rf Layout

    LTE Module Series EG95 Hardware Design NOTES Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity. Place the π-type matching components (R1/C1/C2, R2/C3/C4) as close to the antenna as possible.

  • Page 54: Figure 33: Coplanar Waveguide Line Design On A 4-Layer Pcb (Layer 3 As Reference Ground)

    LTE Module Series EG95 Hardware Design Figure 33: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ...

  • Page 55: Gnss Antenna Interface

    LTE Module Series EG95 Hardware Design 5.2. GNSS Antenna Interface The GNSS antenna interface is only supported on EG95-NA.The following tables show pin definition and frequency specification of GNSS antenna interface. Table 23: Pin Definition of GNSS Antenna Interface Pin Name Pin No.

  • Page 56: Antenna Installation

    LTE Module Series EG95 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 25: Antenna Requirements Type Requirements Frequency range: 1561MHz ~ 1615MHz Polarization: RHCP or linear VSWR: <...

  • Page 57: Recommended Rf Connector For Antenna Installation

    LTE Module Series EG95 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by HIROSE. Figure 36: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.

  • Page 58: Figure 38: Space Factor Of Mated Connector (Unit: Mm)

    LTE Module Series EG95 Hardware Design The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG95_Hardware_Design 57 / 81...

  • Page 59: Electrical, Reliability And Radio Characteristics

    LTE Module Series EG95 Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 26: Absolute Maximum Ratings Parameter Min.

  • Page 60: Operation And Storage Temperatures

    LTE Module Series EG95 Hardware Design Voltage drop during Maximum power control burst transmission level on EGSM900 Peak supply current Maximum power control (during transmission VBAT level on EGSM900 slot) USB connection USB_VBUS 5.25 detection 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table.

  • Page 61: Current Consumption

    LTE Module Series EG95 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 29: EG95-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspend)
  • Page 62 LTE Module Series EG95 Hardware Design EGSM900 1DL/4UL @29.45dBm DCS1800 4DL/1UL @29.14dBm DCS1800 3DL/2UL @29.07dBm DCS1800 2DL/3UL @28.97dBm DCS1800 1DL/4UL @28.88dBm EGSM900 4DL/1UL PCL=8 @26.88dBm EGSM900 3DL/2UL PCL=8 @26.84dBm EGSM900 2DL/3UL PCL=8 @26.76dBm EGSM900 1DL/4UL PCL=8 @26.54dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @25.66dBm DCS1800 3DL/2UL PCL=2 @25.59dBm DCS1800 2DL/3UL PCL=2 @25.51dBm...

  • Page 63: Table 30: Eg95-Na Current Consumption

    LTE Module Series EG95 Hardware Design WCDMA B1 @22.91dBm WCDMA voice call WCDMA B8 @23.14dBm Table 30: EG95-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspend) Sleep state WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected)

  • Page 64: Rf Output Power

    LTE Module Series EG95 Hardware Design LTE-FDD B5 @ TBD dBm LTE-FDD B12 @ TBD dBm LTE-FDD B13 @ TBD dBm WCDMA B2 @ TBD dBm WCDMA WCDMA B4 @ TBD dBm voice call WCDMA B5 @ TBD dBm Table 31: GNSS Current Consumption of EG95-NA Parameter Description Conditions...

  • Page 65: Rf Receiving Sensitivity

    In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG95 module. Table 33: EG95-E Conducted RF Receiving Sensitivity Frequency Primary Diversity...

  • Page 66: Electrostatic Discharge

    LTE Module Series EG95 Hardware Design Table 34: EG95-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -104.7dBm WCDMA B4 -106.7dBm WCDMA B5 -104.7dBm LTE-FDD B2 (10M) -94.3dBm LTE-FDD B4 (10M) -96.3dBm LTE-FDD B5 (10M) -94.3dBm LTE-FDD B12 (10M) -93.3dBm LTE-FDD B13 (10M) -93.3dBm...

  • Page 67: Thermal Consideration

    LTE Module Series EG95 Hardware Design 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration:  On customers’ PCB design, please keep placement of the module away from heating sources, especially high power components such as ARM processor, audio power amplifier, power supply, etc.

  • Page 68: Figure 40: Referenced Heatsink Design (Heatsink At The Bottom Of Customers' Pcb)

    LTE Module Series EG95 Hardware Design Thermal Pad Thermal Pad EG95 Module Heatsink Heatsink Application Board Shielding Cover Application Board Figure 40: Referenced Heatsink Design (Heatsink at the Bottom of Customers’ PCB) NOTE The module offers the best performance when the internal BB chip stays below 105° C. When the maximum temperature of the BB chip reaches or exceeds 105°...

  • Page 69: Mechanical Dimensions

    LTE Module Series EG95 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ± 0.05mm. 7.1. Mechanical Dimensions of the Module 25±0.15 2.25±0.2 Figure 41: Module Top and Side Dimensions EG95_Hardware_Design...

  • Page 70: Figure 42: Module Bottom Dimensions (Top View)

    LTE Module Series EG95 Hardware Design Figure 42: Module Bottom Dimensions (Top View) EG95_Hardware_Design 69 / 81...

  • Page 71: Recommended Footprint

    LTE Module Series EG95 Hardware Design 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EG95_Hardware_Design 70 / 81...

  • Page 72: Design Effect Drawings Of The Module

    Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are design effect drawings of EG95 module. For more accurate pictures, please refer to the module that you get from Quectel. EG95_Hardware_Design 71 / 81...

  • Page 73: Storage, Manufacturing And Packaging

    LTE Module Series EG95 Hardware Design Storage, Manufacturing and Packaging 8.1. Storage EG95 is stored in a vacuum-sealed bag. The storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40º C/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: ...

  • Page 74: Manufacturing And Soldering

    LTE Module Series EG95 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.

  • Page 75: Packaging

    LTE Module Series EG95 Hardware Design 8.3. Packaging EG95 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. The reel is 330mm in diameter and each reel contains 250pcs modules. The following figures show the packaging details, measured in mm.

  • Page 76: Appendix A References

    LTE Module Series EG95 Hardware Design Appendix A References Table 36: Related Documents Document Name Remark Power Management Application Note Quectel_EC2x&EG9x&EM05_Power_Management_ for EC25, EC21, EC20 R2.0, EC20 Application_Note R2.1, EG95, EG91 and EM05 AT Commands Manual for EG95 and Quectel_EG9x_AT_Commands_Manual EG91 Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide...
  • Page 77 LTE Module Series EG95 Hardware Design Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GMSK Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access Input/Output Inorm...
  • Page 78 LTE Module Series EG95 Hardware Design Radio Frequency RHCP Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink UMTS Universal Mobile Telecommunications System Unsolicited Result Code (U)SIM (Universal) Subscriber Identity Module Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin...

  • Page 79: Appendix B Gprs Coding Schemes

    LTE Module Series EG95 Hardware Design Appendix B GPRS Coding Schemes Table 38: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 9.05 13.4 15.6...

  • Page 80: Appendix C Gprs Multi-Slot Classes

    LTE Module Series EG95 Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 81 LTE Module Series EG95 Hardware Design EG95_Hardware_Design 80 / 81...

  • Page 82: Appendix D Edge Modulation And Coding Schemes

    LTE Module Series EG95 Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 40: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps 53.6kbps CS-3: GMSK...
  • Page 83 FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
  • Page 84 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products.
  • Page 85 computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
  • Page 86 The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labelled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains”...
  • Page 87 A label with the following statements must be attached to the host end product: This device contains IC:10224A-2018EG95NA. The manual provides guidance to the host manufacturer will be included in the documentation that will be provided to the OEM. The module is limited to installation in mobile or fixed applications. The separate approval is required for all other operating configurations, including portable configurations and different antenna configurations.

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